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INTRODUCTION
The TR7700QB SII is the bottom-view 3D AOI solution with 15 µm high resolution 12 MP imaging capable of metrology-grade inspection. The TR7700QB SII is designed for high coverage inspection for Through-hole technology components and dual in-line package. The smart factory ready solution is capable of data exchange and eases MES connectivity.
• High Speed Bottom-view 3D AOI, up to 57 cm2/sec
• Inspect in Minutes with Smart Programming
• High Defect Coverage Inspection for THT/DIP
• Metrology-grade Inspection for precise measurements
Optical System
| Imaging Method |
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| Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Field of View |
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Inspection Performance
| Imaging Speed |
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| Height Resolution |
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| Max. Solder Height |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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| Z-Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Optical System
| Imaging Method |
Stop-and-Go |
| Camera |
12 MP High Speed Camera |
| Angle Camera |
N/A |
| Imaging Resolution |
15 μm |
| Lighting |
Multi-phase True Color LED |
| 3D Technology |
Quad Digital Fringe Projectors |
| Max. 3D Range |
20 mm |
Inspection Performance
| Imaging Speed |
57 cm²/sec
* Depending on component distribution |
Motion Table & Control
| X-Axis Control |
Ballscrew + AC Servo with Motion Controller |
| Y-Axis Control |
Ballscrew + AC Servo with Motion Controller |
| Z-Axis Control |
Ballscrew + AC Servo with Motion Controller |
| X-Y Axis Resolution |
1 μm with linear encoder |
Board Handling
| Max PCB Size |
510 x 510 mm |
| PCB Thickness |
0.6 - 6 mm |
| Max PCB Weight |
3kg. Optional: 5 kg |
| Top Clearance |
100 mm |
| Bottom Clearance |
40 mm |
| Edge Clearance |
3 mm. Optional: 5 mm |
| Conveyor |
Inline Height: 830 - 870 mm
* Optional: 900 mm |
Inspection Functions
| Component |
Missing, Tombstoning, Billboarding, Polarity, Rotation, Shift, Wrong Marking (OCV), Defective, Upside Down, Extra Component, Foreign Material, Lifted Component, Bridge, Pin Height |
| THT Defects |
Missing, Position, Soldering Defects, Pinhole, Blowhole, Pin Height,
Pin Angle, Pin Offset, Bridging, Wetting
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| Solder |
Solder Fillet Height, Solder Volume %, Excess Solder, Insufficient Solder, Bridging, Through-hole Pins, Lifted Lead, Golden Finger Scratch/ Contamination |
Dimensions
| WxDxH |
1100 x 1730 x 1585 mm
Note: not including signal tower, signal tower height 515 mm |
| Weight |
1030 kg |
Imaging System
| Camera |
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| X-ray Source |
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| Imaging Resolution |
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| Inspection Method |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
|
Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Dimensions
| WxDxH |
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| Weight |
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| Power Requirement |
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