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News

AI-Powered Inspection at NEPCON China 2026

2026/04/27

TRI productronica China 2026[April 27, 2026 – Taipei, Taiwan] Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join NEPCON China 2026 held at Shanghai World Expo Exhibition & Convention Center from June 2 – 4, 2026. Visit booth #1G80 to experience the latest in Electronics Manufacturing Inspection.

TRI's 2026 lineup includes AI-powered solutions ranging from solder paste inspection to Full coverage X-Ray Inspection. The following machines will be featured at TRI's NEPCON China 2026 booth:

- TR7007Q SII-S: Back-end Bump, C4 Bumps (~100 μm Ø), and 008004 paste inspection.
- TR7700QH SII: the Ultra-High-Speed 3D AOI, archives industry-leading speed of up to 80 cm²/sec.
- TR7500QE Plus: Multi-angle 3D AOI TR7500QE Plus, equipped with four side cameras and 1 top camera.
- TR7600FB SII: 3D CT AXI with New Imaging structure to address diverse product layout.
- TR5001 SII Inline: Modular Multi-Core In-Circuit Tester.

Visit TRI's booth #1G80 at NEPCON China 2026 for a personal demonstration of TRI's Industry Leading Solutions for the electronics manufacturing and the Semiconductor and Advanced Packaging Industry.
 

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About TRI

Test Research, Inc. (TRI) provides the most cost-effective solutions to meet a comprehensive range of manufacturing test and inspection requirements, from Automatic Test and Inspection solutions to Manufacturing Defect Analyzers, In-Circuit Testers, and Functional Testers. Learn more at http://www.tri.com.tw. For sales and service information, please write to us at suzhou@cn.tri.com.tw or call +86 512 68250001.
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