[September 16, 2024 – Taipei, Taiwan] Test Research, Inc. (TRI), the leading provider of test and inspection systems for the electronics manufacturing industry, is set to participate in NEPCON Asia, taking place at the Shenzhen World Exhibition & Convention Center (Baoan New Hall) from November 6 to 8, 2024. Visit booth #9E60 to experience the latest in Advanced Packaging and Electronics Manufacturing Inspection.
TRI will unveil the newly released 3D SEMI AOI,
TR7700Q SII-S, designed for high-reliability industries. Equipped with superior specifications, including a 25MP camera, 2.5 µm high-resolution, AI-powered inspection algorithms, and precise Metrology measurements, this system sets new standards in accuracy and efficiency.
TRI's 2024 lineup includes the
High Speed Line Inspection solutions, TR7700QH SII 3D AOI, and TR7600LL SV 3D AXI. The Ultra-High-Speed 3D AOI,
TR7700QH SII, is capable of inspecting at speeds of up to 80 cm²/sec while maintaining uncompromised Gauge R&R. The
TR7600LL SV is the newly released line scan 3D AXI, offering up to a 20% performance improvement compared to the award-winning TR7600 SIII series.
TRI will also showcase the high-speed multi-angle 3D AOI,
TR7500QE Plus, equipped with four side cameras and 1 top high-resolution camera. TRI's lineup will also include the enhanced 3D SPI
TR7007Q SII, the high-end, high-resolution 3D AXI
TR7600F3D LL SII, and the Multi-core ICT
TR5001Q SII LED INLINE.
Realize your production line's potential with TRI's PCBA Test and Inspection solutions and Industry 4.0 data-driven management system, YMS 4.0. TRI's systems are designed to interoperate with other manufacturing equipment to minimize downtime, optimize production quality, and reduce operator workload.
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