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INTRODUCTION
The TR7600 SIII Plus is TRI's high-throughput 3D SEMI AXI system designed for high-reliability industries like Semiconductor, Advanced Packaging, Automotive, Aerospace, and Medical. Equipped with Multi-Resolution (2 µm - 20 µm) capabilities, the 3D SEMI AXI ensures fast, accurate inspection of components such as C4 bumps, SiP, and Cu Pillars. The TR7600 SIII Plus supports large board sizes up to 800 x 350 mm and weights up to 12 kg. Powered by AI algorithms, including AI-Void Detection and AI Repair Station, the TR7600 SIII Plus ensures enhanced defect detection.
• High Speed 3D SEMI AXI, optimized to meet the throughput demands of OSATs
• AI-Powered Inspection algorithms for precise defect detection
• Inspection Capabilities: C4 bumps (70 µm to 140 µm) and Cu Pillars
• Flexible Multi-Resolution Platform: 2 – 20 µm production
• Inline fine-tuning without interrupting
• Large Board Inspection, up to 800 mm x 350 mm, up to 12 kg in weight
• Smart Factory Ready with MES Connectivity
• Applications: Advanced Packaging, Automotive, Aerospace, Medical
Imaging System
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Camera |
Ultra-High Speed Line-Scan CCD Cameras |
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X-ray Source |
60 - 110 kV |
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Imaging Resolution |
2 μm - 20 μm |
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Inspection Method |
2D, 2.5D, 3D Slicing, Planar CT (Optional) |
Motion Table & Control
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X Axis Control |
High-precision ballscrew + AC-servo controller |
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Y Axis Control |
High-precision ballscrew + AC-servo controller |
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Z Axis Control |
High-precision ballscrew + AC-servo controller |
Board Handling
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Max. PCB Size |
2 μm - 3 μm: 245 x 100 mm
7 μm - 20 μm: 800 x 350 mm |
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PCB Thickness |
0.6 - 7 mm (Optional: 0.4 mm, Max. PCB Weight: 3 kg) |
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Max. PCB Weight |
12 kg |
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Top Clearance |
@ 20 μm: 50 mm
@ 15 μm: 45 mm
@ 10 μm: 29 mm
@ 7 μm: 19 mm
@ 3 μm: 5 mm
@ 2 μm: 3 mm
Note: Calibration is required for non-standard resolutions. |
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Bottom Clearance |
70 mm |
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Edge Clearance |
3 mm or 5 mm |
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Conveyor |
880 – 920 mm. (Optional: 940 - 965 mm)
* SMEMA Compatible |
Inspection Functions
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Capabilities |
BGAs
Backdrill
Barrel fill
Capacitors
Resistor
Chips
Components Under RF shields
WLCSP
DIMM Connectors
Flip-Chips
Ground Pads
Gullwing
Heat sinks
J-Leads
LED Chips
LGAs
Paladin Connector
RNET
SiP
SMT Connectors
SOIC
SOT
Thermal Pad
QFNs
QFP
THTs |
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Defects |
Missing
Misalignment
Tombstone
Billboard
Tantalum Polarity
Rotation
Foreign Material
Insufficient/Excess Solder
Bridging
Open
Solder Ball
Non-Wetting
Void
Lifted Lead |
Dimensions
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WxDxH |
1470 x 1971 x 1975 mm
Note: not including signal tower, height: 519 mm |
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Weight |
3870 kg |
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Power Requirement |
200 - 240 VAC single phase, 50/60 Hz, 4 kVA |
Optical System
| Imaging Method |
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| Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Field of View |
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Inspection Performance
| Imaging Speed |
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| Height Resolution |
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| Max. Solder Height |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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| Z-Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Optical System
| Imaging Method |
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| Top Camera |
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| Angle Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Max. 3D Range |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor |
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Imaging System
| Camera |
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| X-ray Source |
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| Imaging Resolution |
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| Inspection Method |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Dimensions
| WxDxH |
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| Weight |
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| Power Requirement |
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