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TR8100 SII INLINE
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TR8100L SII INLINE
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INTRODUCTION
The TRI TR8100 SII INLINE is a high-pin-count In-Circuit Tester (ICT) and Functional Tester (FCT) designed to address the increasing demand for advanced AI server boards and the evolving needs of the Telecom electronics manufacturing industry. TR8100 SII's vacuum fixture system ensures full pin contact, and with up to 7,056 pins digital MUX-free architecture, the system allows for faster and simpler testing of large pin-count devices and fast program development. The ICT has built-in self-diagnostics to ensure long-term testing reliability. The TR8100 SII integrates seamlessly into existing manufacturing ecosystems, offering full compatibility with legacy TRI modules, fixtures, and test programs, ensuring smooth adoption without costly replacements or reprogramming. Its extensive test coverage also reduces production defects and rework expenses.
• High-pin-count ICT + FCT solution with up to 7,056 test points.
• High fault coverage and advanced test capabilities.
• Non-multiplexing 1:1 independent per-pin architecture
• Low voltage device testing and rapid test speed
• Accommodates various board sizes and testing requirements, supporting multiple industry standards, including AI servers, 5G, and AIoT boards.
• Vacuum fixture ensures rapid and precise board handling.
• Ergonomic and Operator Friendly Design for Easy Fixture Debugging.
• Built-in Self Diagnostics and Auto-Calibration by DMM
• Intuitive UI with flow-based easy program development
Tester Specifications
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Max. Test Points |
TR8100L SII INLINE: 3,584 Points. Optional: 7,056 Points
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Operating System |
Microsoft® Windows 11 |
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Fixture Type |
Vacuum type |
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Max. PCB Size |
TR8100L SII INLINE: 50 x 90 – 920 x 610 mm |
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Max. PCB Weight |
8 kg. Optional: 15 kg |
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Max. Component Height Clearance |
Top: 90 mm / Bottom: 30 mm / Edge: 3 mm. Optional: 5 mm
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Conveyor Height |
900 – 970 mm |
Standard Testing Components
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Analog Test Hardware |
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6-wire measurement switching matrix
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Programmable AC/DC/DC High voltage and current sources
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AC/DC voltage, DC current measurement, frequency
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Component R/L/C measurement
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Synthesized Arbitrary Waveform Generator
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TestJet vectorless open circuit detection
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Digital Testing |
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Non-multiplexing 1:1 per pin architecture with independent per-pin level setting
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DUT Power Supplies:
(1) Fixed: +5V@5A, +3.3V@5A, +12V@5A, +12V@1A
(2) Programmable: +0.2V~+20V@3A (2sets), -3V~-20V@3A (2 sets)
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On-board Flash and EEPROM Memories.
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Industry 4.0
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Communication Standard |
SMEMA, SECS/GEM, IPC-CFX-2591, IPC-HERMES-9852 |
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Yield Management System |
YMS 4.0 (Optional) |
Optional Components
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Analog Hardware |
Fixture Conversion Kits for Teradyne, GenRad |
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Digital Testing |
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APPS Power Supplies: Programmable 75 V/8 A/200 W Max., 1 Channel
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Includes BScan Chain Test, BScan Cluster Test, BScan Virtual Nails Test, BScan Virtual Chain Test and IEEE1149.6 Test
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Serial Test Controller (STC) Programming
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DPS Programmable DUT Power supply:
(1) DPS3514: 30Vmax/5Amax/100Wmax per channel /4CH per DPS
(2) DPS3122: 30Vmax/10Amax/200Wmax per channel /2CH per DPS
(3) SPS5450 : 54Vmax/50Amax/2400Wmax per channel/1CH per rack
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ToggleScan Test
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VregTestTM: Multi-Phase PWM Individual Phase Frequency & Duty P/N Measurements
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System Requirement
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Power Requirement |
200 – 240 VAC, Single Phase, 50/60 Hz, 6 kVA.
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Power Feature |
Power Line Earth Ground Auto Detection. Power 50/60 Hz Auto Detection. |
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Air Requirement |
Dry Air 4 – 8 kg/cm2 |
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Vacuum Requirement |
Min. -0.86 bar (-12.6 psi), Exhaust: 70 m3/h |
Dimensions
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WxDxH |
TR8100L SII INLINE: 1550 x 1450 x 1870 mm |
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Weight |
TR8100L SII INLINE: 1200 kg |
Optical System
| Imaging Method |
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| Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Field of View |
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Inspection Performance
| Imaging Speed |
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| Height Resolution |
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| Max. Solder Height |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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| Z-Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Optical System
| Imaging Method |
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| Top Camera |
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| Angle Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Max. 3D Range |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor |
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Imaging System
| Camera |
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| X-ray Source |
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| Imaging Resolution |
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| Inspection Method |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Dimensions
| WxDxH |
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| Weight |
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| Power Requirement |
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