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INTRODUCTION
Die neueste Generation von TRI's ICT+FCT Lösung bietet eine bahnbrechende Leistungsfähigkeit beim Multi-Core Parallel-Test mit bis zu 4 voneinander unabhängigen Cores für hohen Durchsatz. Bei verbesserter Messgenauigkeit sorgt die in den Systemen TR5001Q/D SII's neu eingebaute Auto-Kalibrierungs- und Selbstdiagnosefunktion langfristig für zuverlässiges Testen.
• Flexibler Multi-Core Parallel Tester der neuen Generation
• Serieller Test Controller nach dem neuesten Stand der Technik mit bis zu 8 Ports an jedem Pin
• Limitierter Zugriff und funktionelle Testerweiterung über PXI-Module
• Eingebaute Selbst-Diagnose- und Auto-Kalibrierungsfunktion
• Messung und Test mit hoher Genauigkeit
• Intuitive Bedienerführung mit einfacher ablauforientierter Programmentwicklung
Tester Specifications
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Analog/hybrid test points |
TR5001Q SII: 4096
TR5001D SII: 3328
TR5001 SII: 3456 |
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Operating System |
Microsoft® Windows compatible PC with USB, Windows 7-10 |
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Fixture Type |
Offline press type fixture |
Standard Testing Components
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Analog Test Hardware |
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6-wire measurement switching matrix
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Programmable AC/DC/DC High voltage and current sources
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AC/DC voltage, DC current measurement
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Component R/L/C measurement
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Optional Components
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Analog Hardware |
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TestJet vectorless open circuit detection
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Arbitrary Waveform Generator
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Digital Testing |
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Non-multiplexing 1:1 per pin architecture with independent per-pin level setting
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Serial Test Controller (STC) Programming
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DUT power supplies: 5 V@3 A, 3.3 V@3 A, 12 V@3A, -12 V@1 A and 24 V@3 A
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DPS Programmable DUT Power supply :
(1) DPS3514: 30Vmax/5Amax/100Wmax per channel /4CH per DPS
(2) DPS3122: 30Vmax/10Amax/200Wmax per channel /2CH per DPS
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Programmable DUT power supplies: 75 V / 8 A max, 200W maximum output power
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Includes BScan Chain Test, BScan Cluster Test, BScan Virtual Nails Test, BScan Virtual Chain Test and IEEE1149.6 Test
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Up to 8 High Speed Serial Ports, On-board Flash, EEPROM, MAC programming
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Yield Management System |
YMS 4.0 |
Dimensions
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WxDxH |
1050 x 850 x 1735 mm |
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Weight |
300 kg |
Optical System
| Imaging Method |
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| Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Field of View |
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Inspection Performance
| Imaging Speed |
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| Height Resolution |
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| Max. Solder Height |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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| Z-Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Optical System
| Imaging Method |
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| Top Camera |
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| Angle Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Max. 3D Range |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor |
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Imaging System
| Camera |
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| X-ray Source |
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| Imaging Resolution |
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| Inspection Method |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Dimensions
| WxDxH |
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| Weight |
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| Power Requirement |
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