INTRODUCTION
The TR7700Q TB SII offers 3D Top-view and 2D Bottom-view inspection designed for high coverage detection of Through-hole technology (THT), Dual-in-line Package (DiP), and SMD defects. The newly released AOI is equipped with TRI’s innovative AI-powered algorithms and metrology-grade measurements for precision inspection. The Smart Factory Ready solution is capable of data exchange, eases MES connectivity, and supports current smart factory standards, such as IPC-CFX, IPC-DPMX, and The Hermes Standard (IPC-HERMES-9852).
• High-Speed 3D Top-view and 2D Bottom-view AOI, up to 57 cm2/sec
• High Defect Coverage Inspection for THT/DIP
• AI-powered Algorithms with Smart Programming
• Metrology-grade Inspection for precise measurements
• Industry 4.0 Ready Platform
Optical System
|
Imaging Method |
Stop-and-Go Imaging |
|
Top Camera (3D)* |
12 Mpix. Resolution: 10 µm, 15 µm |
|
Bottom Camera (2D)* |
6.5 Mpix. Resolution: 10 µm, 12.5 µm |
|
3D Technology |
Top: Quad Digital Fringe Projectors. Bottom: N/A |
|
Max. 3D Height Range |
40 mm |
|
Lighting |
Multi-phase True Color LED |
Imaging Performance
|
Max. Imaging Speed |
57 cm²/sec |
Motion Table & Control**
|
X Axis Control |
Ballscrew + AC Servo with Motion Controller |
|
Y Axis Control |
Ballscrew + AC Servo with Motion Controller |
|
Z Axis Control |
Ballscrew + AC Servo with Motion Controller |
|
X-Y-Z Axis Resolution |
1 µm |
Board Handling
|
Max. PCB Size |
510 x 510 mm |
|
PCB Thickness |
0.5-6 mm |
|
Max. PCB Weight |
3 kg. Optional: 5kg |
|
Top Clearance |
50mm |
|
Bottom Clearance |
40 mm |
|
Conveyor |
Inline Height: 880-920 mm. Optional: 940-965 mm
Note: SMEMA Compatible |
Inspection Functions
|
Component Defects |
Missing
Tombstoning
Billboarding
Polarity
Rotation
Shift
Wrong Marking (OCV)
Defective, Upside Down
Extra Component
Foreign Material
Lifted Component |
|
THT Defects |
Missing
Position
Soldering Defects
Pinhole
Blowhole
Pin Height
Pin Angle
Pin Offset
Bridging
Wetting
|
|
Solder Joint Defects |
Solder Fillet Height
Solder Volume %
Excess Solder
Insufficient Solder
Bridging
Through-hole Pins
Lifted Lead
Golden Finger Scratch/ Contamination |
Dimensions
|
WxDxH |
1200 x 2020 x 2000 mm
Note: not including signal tower, signal tower height 488 mm |
|
Weight |
1720 kg |
|
* Choose between Configuration 1: Top 12 MP 10 μm Bottom 6.5 M 10 μm or
Configuration 2: Top 12 MP 15 μm Bottom 6.5 MP 12.5 μm.
** Optional: Z-Axis for Bottom-up; Linear Encoder Module; Dual Ball Screw + Servo Motor
|
Optical System
| Imaging Method |
|
| Camera |
|
| Imaging Resolution |
|
| Lighting |
|
| 3D Technology |
|
| Field of View |
|
Inspection Performance
| Imaging Speed |
|
| Height Resolution |
|
| Max. Solder Height |
|
Motion Table & Control
| X-Axis Control |
|
| Y-Axis Control |
|
| Z-Axis Control |
|
| X-Y Axis Resolution |
|
| Z-Axis Resolution |
|
Board Handling
| Max PCB Size |
|
| PCB Thickness |
|
| Max PCB Weight |
|
| Top Clearance |
|
| Bottom Clearance |
|
| Edge Clearance |
|
| Conveyor Height |
|
Optical System
| Imaging Method |
|
| Top Camera |
|
| Angle Camera |
|
| Imaging Resolution |
|
| Lighting |
|
| 3D Technology |
|
| Max. 3D Range |
|
Motion Table & Control
| X-Axis Control |
|
| Y-Axis Control |
|
| Z-Axis Control |
|
| X-Y Axis Resolution |
|
Board Handling
| Max PCB Size |
|
| PCB Thickness |
|
| Max PCB Weight |
|
| Top Clearance |
|
| Bottom Clearance |
|
| Edge Clearance |
|
| Conveyor |
|
Imaging System
| Camera |
|
| X-ray Source |
|
| Imaging Resolution |
|
| Inspection Method |
|
Motion Table & Control
| X-Axis Control |
|
| Y-Axis Control |
|
| Z-Axis Control |
|
| X-Y Axis Resolution |
|
Board Handling
| Max PCB Size |
|
| PCB Thickness |
|
| Max PCB Weight |
|
| Top Clearance |
|
| Bottom Clearance |
|
| Edge Clearance |
|
| Conveyor Height |
|
Dimensions
| WxDxH |
|
| Weight |
|
| Power Requirement |
|
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