Automatisierte Optische Inspektion (AOI)
INTRODUCTION
The TR7700QC SII 3D AOI is equipped with essential inspection functionalities for multiple electronics manufacturing industry applications. The 3D AOI features user-friendly programming for easy setup, flexible IPC-610 inspection algorithms, and compliance with the latest Smart Factory standards.
• 3D AOI with Essential Features for Components and Solder Joints Inspection
VIDEO
Optical System
Imaging Method
Camera
Imaging Resolution
Lighting
3D Technology
Field of View
Inspection Performance
Imaging Speed
Height Resolution
Max. Solder Height
Motion Table & Control
X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution
Z-Axis Resolution
Board Handling
Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height
Optical System
Imaging Method
Stop-and-Go
Top Camera
12 MP High Speed Camera
Angle Camera
N/A
Imaging Resolution
10 µm, 12 µm, 15 µm (factory setting)
Lighting
Multi-phase True Color LED
3D Technology
Quad Digital Fringe Projectors
Max. 3D Range
40 mm
Inspection Performance
Imaging Speed
@ 10 μm: 25 cm²/sec
Motion Table & Control
X-Axis Control
Ballscrew + AC Servo with Motion Controller
Y-Axis Control
Ballscrew + AC Servo with Motion Controller
Z-Axis Control
Ballscrew + AC Servo with Motion Controller
X-Y Axis Resolution
1 μm
Board Handling
Max PCB Size
TR7700QC SII: 510 x 460 mm
PCB Thickness
0.6-5 mm
Max PCB Weight
TR7700QC SII: 3 kg. Optional: 5kg
Top Clearance
50 mm
Bottom Clearance
40 mm
Edge Clearance
3 mm. Optional: 4 mm / 5 mm
Conveyor
Inline Height: 880 – 920 mm
Inspection Functions
Component
Missing, Tombstoning, Billboarding, Polarity, Rotation, Shift, Wrong Marking (OCV), Defective, Upside Down, Extra Component, Foreign Material, Lifted Component
Solder
Solder Fillet Height, Solder Volume %, Excess Solder, Insufficient Solder, Bridging, Through-hole Pins, Lifted Lead, Golden Finger Scratch/ Contamination
Dimensions
WxDxH
TR7700QC SII: 1100 x 1720 x 1710 mm
Weight
TR7700QC SII: 910 kg
Imaging System
Camera
X-ray Source
Imaging Resolution
Inspection Method
Motion Table & Control
X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution
Board Handling
Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height
Dimensions
WxDxH
Weight
Power Requirement
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