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INTRODUCTION
The TR7700Q SII-S is the next-generation AI-powered Inspection platform for the Semiconductor & Advanced Packaging Industry. The 3D SEMI AOI is enhanced with metrology capabilities and multiple imaging technologies to achieve full coverage inspection. The 2.5 μm High Resolution platform solution can inspect wire diameters of up to 15 μm (0.6 mil). The 3D AOI supports current Smart Factory Standards, including IPC-CFX and The Hermes Standard (IPC-HERMES-9852).
Inspection for: wire bonding, die bonding, ball bonding, ribbon bond, wedge bond, SiP, underfill, SMD, bumps, and solder joints.
• 2.5 μm High-Resolution 3D SEMI Back-end AOI
• Precise Metrology-Grade Measurements*
• AI-powered Inspection with AI Smart Programming*
• Inspection of Au, Al, Ag, and Cu Wires down to 15 μm dimensions
• Bond Inspection: ball bond, wedge bond, and ribbon bond
• Shortwave Infrared (SWIR) Lighting to detect inner cracks and chipping*
• Industry 4.0 Ready Platform
*Optional
Optical System
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Imaging Method |
Stop-and-Go Imaging |
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Top Camera |
12 Mpix / 21 Mpix / 25 Mpix |
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Imaging Resolution |
2.5 µm / 5 µm / 5.5 µm / 7 µm / 8 µm |
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Lighting |
Multi-phase True Color LED |
Imaging Performance
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Max. Imaging Speed |
@2.5 µm: 3.5 cm²/sec (1)
@5 µm: 13 cm²/sec
@5.5 µm: 7.8 cm²/sec
@7 µm: 24 cm²/sec
@8 µm: 29 cm²/sec
* (1) Available for TR7700Q SII-S |
Motion Table & Control
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X Axis Control |
Ballscrew + AC Servo with Motion Controller |
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Y Axis Control |
Dual Driven Ball Screw + AC Servo Motor |
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Z Axis Control |
Ballscrew + AC Servo with Motion Controller |
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X-Y-Z Axis Resolution |
1 µm |
Board Handling
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Max. PCB Size* |
TR7700Q SII-S: 510 x 460 mm, @2.5 μm: 285×150 mm
TR7700Q SII-S DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane
* Larger PCB size requires additional memory. |
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PCB Thickness |
0.6-5 mm |
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Max. PCB Weight |
3 kg. Optional: 5kg |
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Top Clearance |
TR7700Q SII-S: 20 mm
TR7700Q SII-S DL: 20 mm
21MP 8µm: Top Clearance: 50mm |
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Bottom Clearance |
40 mm |
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Edge Clearance |
3 mm. Optional: 4 mm / 5 mm |
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Conveyor |
Inline Height: 880 – 920 mm
* SMEMA Compatible |
Inspection Functions
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Component Defects |
Missing
Tombstoning
Billboarding
Polarity
Rotation
Shift
Wrong Marking (OCV)
Defective, Upside Down
Extra Component
Foreign Material
Lifted Component |
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Solder Joint Defects |
Solder Fillet Height
Solder Volume %
Excess Solder
Insufficient Solder
Bridging
Through-hole Pins
Lifted Lead
Golden Finger Scratch/ Contamination |
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Die Bonding |
Missing
Orientation
Shift
Rotation
Chipping
Crack
Scratch
Foreign Material
Epoxy on Die
Epoxy Coverage
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Wire Bonding
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Broken
Short
Sweep/Sink
Missing
Sway
Collapse
Loop Height
Sagged Wire
Cross Wire Gap
Wire Tracing
Ball Bond Diameter
Ball Placement
Stitch Width
Stitch Coverage over Ball
Ball-off Pad
Ball touch Pad Distance
Clubbed Ball
Ball Thickness
Lifted Ball
Low Landing
Bond on Contamination
Foreign Material
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Bonding Area/Pad |
Copper Protrusion
Crack
Chipping
Exposed Copper
Exposed Nickel
Target Material
Scratches or Brush Marks
Oxidation
Foreign Material
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Dimensions
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WxDxH |
TR7700Q SII-S: 1100 x 1720 x 1710 mm
TR7700Q SII-S DL: 1100 x 1820 x 1710 mm
Note: not including signal tower, signal tower height 515 mm |
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Weight |
TR7700Q SII-S: 910 kg
TR7700Q SII-S DL: 960 kg |
Optical System
| Imaging Method |
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| Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Field of View |
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Inspection Performance
| Imaging Speed |
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| Height Resolution |
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| Max. Solder Height |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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| Z-Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Optical System
| Imaging Method |
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| Top Camera |
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| Angle Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Max. 3D Range |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor |
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Imaging System
| Camera |
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| X-ray Source |
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| Imaging Resolution |
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| Inspection Method |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Dimensions
| WxDxH |
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| Weight |
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| Power Requirement |
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