|
|
INTRODUCTION
The TR5001E SII provides an economical, customizable solution that can fully meet the testing requirements of most customers. The TR5001E SII incorporates MDA with selectable ICT and Functional test capabilities that cut production line staff. The ICT platform has built-in auto-calibration and self-diagnostics to ensure long-term testing reliability.
• Modular upgrade options from MDA to ICT and functional test
• Built-in Self Diagnostics and Auto-Calibration function
• High Speed and Accuracy Measurement and Testing
• Friendly UI with fast and easy program development
Tester Specifications
|
Analog/hybrid test points |
TR5001E SII: 3456
TR5001E SII INLINE: 2496 |
|
Operating System |
Microsoft® Windows 11 |
|
Fixture Type |
Inline or Offline Press Type. Inline with Long Lifespan Quick Disconnection Interface |
Standard Testing Components
|
Analog Test Hardware |
-
6-wire measurement switching matrix
-
Programmable AC/DC/DC High voltage and current sources
-
AC/DC voltage, DC current measurement
-
Component R/L/C measurement
|
Optional Components
|
Analog Hardware |
-
TestJet vectorless open circuit detection
-
Arbitrary Waveform Generator
|
|
Digital Testing |
-
Non-multiplexing 1:1 per pin architecture with independent per-pin level setting
-
DUT power supplies:
(1) 5 V@3 A, 3.3 V@3 A, 12 V@3A, -12 V@1 A and 24 V@3 A
(2) Programable Power (2 CH): 0.2 – 3 V@2 A max. or 3 – 24 V@3 A max.
-
DPS Programmable DUT Power supply :
(1) DPS3514: 30Vmax/5Amax/100Wmax per channel /4CH per DPS
(2) DPS3122: 30Vmax/10Amax/200Wmax per channel /2CH per DPS
(3) APPS7508: 75 V max. / 8 A max. / 200 W max.
-
Boundary Scan: Includes BScan Chain Test, BScan Cluster Test, BScan Virtual Nails Test, BScan Virtual Chain Test and IEEE1149.6 Test
-
On-board Flash, EEPROM, MAC programming
-
ToggleScan Test: Advanced Test Technology that Combines with BScan and Vectorless Test Functions to Detect Pin Open or Short Issues
|
|
Yield Management System |
YMS 4.0 |
|
Industry 4.0 Standards |
IPC-Hermes-9852, IPC-CFX |
Board Handling
|
Max. PCB Size |
TR5001E SII: Standard- 420 x 300 mm, Optional- 600 x 350 mm
TR5001E SII INLINE: Standard- 450 x 300 mm, Optional- 500 x 360 mm |
|
PCB Thickness |
0.6 - 5 mm |
Dimensions
|
WxDxH |
TR5001E SII: 1000 x 900 x 1680-1700 mm
TR5001E SII INLINE: 900 x 900 x 1640 mm
Note: not including signal tower,signal tower height: 392 mm |
|
Weight |
TR5001E SII: 200 kg
TR5001E SII INLINE: 480 kg |
Optical System
| Imaging Method |
|
| Camera |
|
| Imaging Resolution |
|
| Lighting |
|
| 3D Technology |
|
| Field of View |
|
Inspection Performance
| Imaging Speed |
|
| Height Resolution |
|
| Max. Solder Height |
|
Motion Table & Control
| X-Axis Control |
|
| Y-Axis Control |
|
| Z-Axis Control |
|
| X-Y Axis Resolution |
|
| Z-Axis Resolution |
|
Board Handling
| Max PCB Size |
|
| PCB Thickness |
|
| Max PCB Weight |
|
| Top Clearance |
|
| Bottom Clearance |
|
| Edge Clearance |
|
| Conveyor Height |
|
Optical System
| Imaging Method |
|
| Top Camera |
|
| Angle Camera |
|
| Imaging Resolution |
|
| Lighting |
|
| 3D Technology |
|
| Max. 3D Range |
|
Motion Table & Control
| X-Axis Control |
|
| Y-Axis Control |
|
| Z-Axis Control |
|
| X-Y Axis Resolution |
|
Board Handling
| Max PCB Size |
|
| PCB Thickness |
|
| Max PCB Weight |
|
| Top Clearance |
|
| Bottom Clearance |
|
| Edge Clearance |
|
| Conveyor |
|
Imaging System
| Camera |
|
| X-ray Source |
|
| Imaging Resolution |
|
| Inspection Method |
|
Motion Table & Control
| X-Axis Control |
|
| Y-Axis Control |
|
| Z-Axis Control |
|
| X-Y Axis Resolution |
|
Board Handling
| Max PCB Size |
|
| PCB Thickness |
|
| Max PCB Weight |
|
| Top Clearance |
|
| Bottom Clearance |
|
| Edge Clearance |
|
| Conveyor Height |
|
Dimensions
| WxDxH |
|
| Weight |
|
| Power Requirement |
|
|
Suchen
Mitgliederbereich
