|
|
Automatisierte Optische Inspektion (AOI)
|
TR7700 SIII Ultra
 |
|
|
|
TR7700 SIII Ultra
|
|
|
INTRODUCTION
The TR7700 SIII Ultra is the latest High Volume AOI, built on an enhanced mechanical platform to guarantee stability, accuracy, and precision during the inspection. The High-Speed AOI is an Industry 4.0 Ready Solution, supporting the upcoming and innovative protocols such as IPC-CFX, IPC-Hermes-9852, and IPC-DPMX.
• Industry-leading Inspection Speed up to 120 cm²/sec
• Ready to Inspect in Minutes with TRI's Smart Programming
• High Accuracy Metrology-grade Measurements
• Enhanced mechanical Design, Increased Stability, and Precision.
• Closed Loop Ready: Feedback and Feedforward Capabilities
• Smart Factory Ready with Real-time SPC Trends
Optical System
| Imaging Method |
|
| Camera |
|
| Imaging Resolution |
|
| Lighting |
|
| 3D Technology |
|
| Field of View |
|
Inspection Performance
| Imaging Speed |
|
| Height Resolution |
|
| Max. Solder Height |
|
Motion Table & Control
| X-Axis Control |
|
| Y-Axis Control |
|
| Z-Axis Control |
|
| X-Y Axis Resolution |
|
| Z-Axis Resolution |
|
Board Handling
| Max PCB Size |
|
| PCB Thickness |
|
| Max PCB Weight |
|
| Top Clearance |
|
| Bottom Clearance |
|
| Edge Clearance |
|
| Conveyor Height |
|
Optical System
| Imaging Method |
Dynamic Imaging |
| Top Camera |
4 MP / 9 MP / 12 MP High Speed Color Camera |
| Angle Camera |
N/A |
| Imaging Resolution |
5.5 µm, 6 µm , 10 µm , 15 µm (factory setting) |
| Lighting |
Multi-phase RGB+W LED |
| 3D Technology |
3D Laser Sensor (Standard for 3D Models) |
| Max. 3D Range |
N/A |
Inspection Performance
| Imaging Speed |
4 MP@ 10 μm: up to 60 cm²/sec
4 MP@ 15 μm: up to 120 cm²/sec
9 MP@ 10 μm: up to 80 cm²/sec
12 MP@ 5.5 μm: up to 32 cm²/sec
12 MP@ 6 μm: up to 37 cm²/sec |
Motion Table & Control
| X-Axis Control |
Ballscrew + AC Servo with Motion Controller |
| Y-Axis Control |
Ballscrew + AC Servo with Motion Controller |
| Z-Axis Control |
Ballscrew + AC Servo with Motion Controller |
| X-Y Axis Resolution |
1 µm |
Board Handling
| Max PCB Size |
TR7700 SIII Ultra (3D): 510 x 460 mm
TR7700M SIII Ultra: 660 x 690 mm
TR7700 SIII Ultra (3D) DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane |
| PCB Thickness |
0.6-5 mm |
| Max PCB Weight |
3 kg. Optional: 5 kg / 12 kg |
| Top Clearance |
25 mm. Optional: 48 mm |
| Bottom Clearance |
40 mm |
| Edge Clearance |
3 mm. Optional: 4 mm / 5 mm |
| Conveyor |
Inline Height: 880 – 920 mm
* Optional: 940-965 mm (SMEMA compatible) |
Inspection Functions
| Component |
Missing
Tombstoning
Billboarding
Polarity
Rotation
Shift
Wrong Marking (OCV)
Defective
Upside Down
Extra Component
Foreign Material |
| Solder |
Excess Solder
Insufficient Solder
Bridging
Through-hole Pins
Lifted Lead
Golden Finger
Scratch/Contamination |
Dimensions
| WxDxH |
TR7700 SIII Ultra (3D): 1100 x 1720 x 1710 mm
TR7700M SIII Ultra: 1250 x 1888 x 1710 mm
TR7700 SIII Ultra (3D) DL: 1365 x 1720 x 1710 mm
Note: Not including signal tower |
| Weight |
TR7700 SIII Ultra (3D): 940 kg
TR7700M SIII Ultra: 992 kg
TR7700 SIII Ultra (3D) DL: 960 kg |
Imaging System
| Camera |
|
| X-ray Source |
|
| Imaging Resolution |
|
| Inspection Method |
|
Motion Table & Control
| X-Axis Control |
|
| Y-Axis Control |
|
| Z-Axis Control |
|
| X-Y Axis Resolution |
|
Board Handling
| Max PCB Size |
|
| PCB Thickness |
|
| Max PCB Weight |
|
| Top Clearance |
|
| Bottom Clearance |
|
| Edge Clearance |
|
| Conveyor Height |
|
Dimensions
| WxDxH |
|
| Weight |
|
| Power Requirement |
|
|
Suchen
Mitgliederbereich
