|
Automatisierte Röntgen-Inspektion (AXI/Automated X-Ray Inspection)
|
INTRODUCTION
Der TR7600F3D LL SII ist die neueste Hochgeschwindigkeits 3D AXI mit CT-Funktionen zum Inspizieren großer Leiterplatten bis zu 1000 x 660 mm. Der TR7600F3D LL SII kann die Schlupfrate und Pseudofehler verringern, ohne die Zykluszeit der Produktionslinie zu beeinträchtigen.
• Intelligente 3D-AXI Anlage zum Inspizieren großer Leiterplatten, bis zu 1000 x 660 mm
• Bis zu 5 µm Auflösung für umfassende Fehlererkennung
• Mechanisches Design der nächsten Generation für höhere Geschwindigkeiten bis zu 20 FOV/s
• Industrie 4.0-Lösung mit einfacher MES Anbindungen
Optical System
Imaging Method |
|
Camera |
|
Imaging Resolution |
|
Lighting |
|
3D Technology |
|
Field of View |
|
Inspection Performance
Imaging Speed |
|
Height Resolution |
|
Max. Solder Height |
|
Motion Table & Control
X-Axis Control |
|
Y-Axis Control |
|
Z-Axis Control |
|
X-Y Axis Resolution |
|
Z-Axis Resolution |
|
Board Handling
Max PCB Size |
|
PCB Thickness |
|
Max PCB Weight |
|
Top Clearance |
|
Bottom Clearance |
|
Edge Clearance |
|
Conveyor Height |
|
Optical System
Imaging Method |
|
Top Camera |
|
Angle Camera |
|
Imaging Resolution |
|
Lighting |
|
3D Technology |
|
Max. 3D Range |
|
Motion Table & Control
X-Axis Control |
|
Y-Axis Control |
|
Z-Axis Control |
|
X-Y Axis Resolution |
|
Board Handling
Max PCB Size |
|
PCB Thickness |
|
Max PCB Weight |
|
Top Clearance |
|
Bottom Clearance |
|
Edge Clearance |
|
Conveyor |
|
Imaging System
Camera |
Flat Panel Detector |
X-ray Source |
130 kV Max (User Adjustable) |
Imaging Resolution |
5 μm ,10 μm, 15 μm, 20 μm, 25 μm, 30 μm |
Inspection Method |
2D, 2.5D, 3D Slicing, Planar CT (Optional) |
Motion Table & Control
X-Axis Control |
High-Precision Ballscrew + AC-Servo Controller |
Y-Axis Control |
High-Precision Ballscrew + AC-Servo Controller |
Z-Axis Control |
High-Precision Ballscrew + AC-Servo Controller |
X-Y Axis Resolution |
N/A |
Board Handling
Max PCB Size |
1000 x 660 mm*
* The Max. PCB Size will vary depending on the angle of incidence |
PCB Thickness |
0.4 - 7 mm |
Max PCB Weight |
12 kg |
Top Clearance |
@ 20/25/30 μm: 50 mm @ 15 μm: 45 mm @ 10 μm: 25 mm @ 5 μm: 5 mm |
Bottom Clearance |
@ 30 μm: 55 mm @ 5/10/15/20/25 μm: 70 mm |
Edge Clearance |
3 mm or 5 mm |
Conveyor Height |
880 - 920 mm
* SMEMA Compatible |
Inspection Functions
Capabilities |
Missing Misalignment Tombstone Billboard Tantalum Polarity Rotation Floating |
Defects |
Insufficient/Excess Solder Bridging Open Solder Ball Non-wetting Void Lifted Lead |
Dimensions
WxDxH |
1730 x 2300 x 1975 mm
Note: not including signal tower, height: 502 mm |
Weight |
4850 kg |
Power Requirement |
200 - 240 VAC single phase, 50/60 Hz, 4 kVA |
|