Automatisierte Röntgen-Inspektion (AXI/Automated X-Ray Inspection)
INTRODUCTION
Das CT-Röntgensystem der Serie TR7600 SIII stellt eine neue Generation von TRI’s Baugruppen-Inspektionslösungen dar. Konzipiert für 100%ige Fehlererkennung bei Produktionsliniengeschwindigkeit, verbindet TR7600 SIII, das modernste automatische Röntgensystem in der Baugruppenprüfung, die schnellste hochauflösende Bilderfassung mit nochmals deutlich verbesserter Bildqualität.
• 3D CT Röntgeninspektion bei Ultra-Hochgeschwindigkeit
• Hervorragende Bildqualität
• Echte 3D-Ansicht der Lötverbindung
• Hohe Auflösung für 01005in Chips
VIDEO
Optical System
Imaging Method
Camera
Imaging Resolution
Lighting
3D Technology
Field of View
Inspection Performance
Imaging Speed
Height Resolution
Max. Solder Height
Motion Table & Control
X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution
Z-Axis Resolution
Board Handling
Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height
Optical System
Imaging Method
Top Camera
Angle Camera
Imaging Resolution
Lighting
3D Technology
Max. 3D Range
Motion Table & Control
X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution
Board Handling
Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor
Imaging System
Camera
Ultra-High Speed Line-Scan CCD Cameras. 3 or 5 Units (9 or 15 Sensors)
X-ray Source
60 -130 kV
Imaging Resolution
7 μm - 20 μm
Inspection Method
2D, 2.5D, 3D Slicing, Planar CT (Optional)
Motion Table & Control
X-Axis Control
High-precision ballscrew + AC-servo controller
Y-Axis Control
High-precision ballscrew + AC-servo controller
Z-Axis Control
High-precision ballscrew + AC-servo controller
X-Y Axis Resolution
N/A
Board Handling
Max PCB Size
900 x 520 mm
PCB Thickness
0.6-7 mm
Max PCB Weight
12 kg
Top Clearance
@ 20 μm: 50 mm @ 15 μm: 30 mm @ 10 μm: 15 mm @ 7 μm: 7 mm
Bottom Clearance
70 mm
Edge Clearance
3 mm or 5 mm
Conveyor Height
880 - 920 mm. Optional: 940-965 mm * SMEMA Compatible
Inspection Functions
Capabilities
Missing Misalignment Tombstone Billboard Tantalum Polarity Rotation Floating
Defects
Insufficient/Excess Solder Bridging Open Solder Ball Non-wetting Void Lifted Lead
Dimensions
WxDxH
1470 x 2110 x 1975 mm Note: not including signal tower, height: 510 mm
Weight
3850 kg
Power Requirement
200 - 240 VAC single phase, 50/60 Hz, 4 kVA