[September 19, 2025 – Shenzhen, China] Test Research, Inc. (TRI), the leading provider of test and inspection systems for the electronics manufacturing industry, will participate in NEPCON Asia at the Shenzhen World Exhibition & Convention Center from October 28 to 30, 2025. Visit booth #11E60 to experience TRI's advanced and flexible Inspection solutions designed to increase your yield rate.
TRI's lineup will feature the new 3D AXI
TR7600FB SII, which incorporates an innovative X-ray imaging structure to address diverse product layouts and is optimized for specialized substrates, BGAs, multilayered structures, and SiP. The TR7600FB SII is the ideal choice for inspecting critical components that need to be imaged with high resolution, as the system allows the tube to get exceptionally close to the board without structural interference. The lineup also includes the High-Power CT AXI
TR7600HP, specifically designed for inspecting power modules, including IGBTs, MOSFETs, and SiC inverters.
The exhibition will also feature the Ultra-High-Speed 3D AOI,
TR7700QH SII, capable of inspecting at speeds of up to 80 cm²/sec, the multi-angle 3D AOI,
TR7500QE Plus, and the enhanced 3D SPI,
TR7007Q SII, with a new optical configuration of 25MP and 10 µm. The ICT lineup includes the Multi-core ICT
TR5001 SII INLINE and the High-Pin Count board tester,
TR8001 SII, specialized for Telecom Data Center Boards Applications.
Discover why the largest EMS companies have chosen TRI as their trusted Test and Inspection partner by visiting Booth No. 11E60 at NEPCON Asia.
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