|
3D-Lötpasten-Inspektion (SPI/Solder Paste Inspection)
|
TR7007Q/QI Plus
 |
|
|
TR7007Q Plus
|
|
|
INTRODUCTION
Die 3D SPI-Plattform TR7007Q/QI Plus ist mit einem verbesserten Motion Controller (EtherCAT) und einem verbesserten 2D-Beleuchtungsmodul ausgestattet. Der TR7007Q/QI Plus kann niedrige Lötbrücken sehr genau prüfen und kann Wölbungen auf der Platinen ausgleichen, um lokale Verformungen der Leiterplatten zu vermeiden. Der TR7007Q/QI Plus ist mit bis zu 4 Projektoren ausgestattet, um eine schattenfreie Inspektion zu gewährleisten. Die SPI-Lösung erleichtert den Datenaustausch zwischen der Produktionslinie und dem MES Ihrer Wahl und ermöglicht damit eine vernetzte Fabrik mit Datenrückverfolgbarkeit.
• Verbesserte 2D-Beleuchtung für eine gleichmäßigere Prüfung
• Neuer Motion Controller EtherCAT für Echtzeitmessungen
• Smart Factory Lösung mit Echtzeit SPC Trends
• Closed Loop Verfügbarkeit: Feedback- und Feedforward-Funktionen
Optical System
Imaging Method |
Stop-and-Go Imaging |
Camera |
4 Mpix or 12 Mpix (factory setting) |
Imaging Resolution |
5.5 μm, 6 μm, 10 μm, 12 μm, 15 µm (factory setting) |
Lighting |
Enhanced 2D Lights (RGB+W) |
3D Technology |
4-way Digital Fringe Pattern |
Field of View |
4 MP Camera Link- @ 10 μm: 20.3x20.3 mm @ 15 μm: 30.5x30.5 mm
12 MP Camera Link- @ 5.5 μm: 22.5x16.5 mm @ 10 μm: 40.6x30.7 mm @ 15 μm: 61x46 mm
12 MP CoaXPress- @ 6 μm: 24.3x18.4 mm @ 10 μm: 40.6x30.7 mm @ 12 μm: 48.7x36.8 mm @ 15 μm: 61x46 mm |
Inspection Performance
Imaging Speed |
4 MP Camera Link: Up to 3 FOV/sec 12 MP Camera Link: Up to 1.8 FOV/sec 12 MP CoaXPress: Up to 2.6 FOV/sec |
Height Resolution |
@10 μm/15 μm: 0.45 μm @5.5 μm/6 μm: 0.22 μm |
Max. Solder Height |
@10 μm/15 μm: 420 μm/750 μm @5.5 μm/6 μm: 210 μm/310 μm
* on Calibration Target |
Motion Table & Control
X-Axis Control |
Ballscrew + EtherCAT motion controller |
Y-Axis Control |
Ballscrew + EtherCAT motion controller |
Z-Axis Control |
Ballscrew + EtherCAT motion controller |
X-Y Axis Resolution |
0.1 μm |
Z-Axis Resolution |
0.1 μm |
Board Handling
Max PCB Size |
TR7007Q/QI Plus:@5.5 μm, 6 μm - 400 x 330 mm, @10, 12, 15 μm - 510 x 460 mm TR7007Q/QI Plus DL:@10, 12, 15 μm - 510x310 mm x 2 Lanes, 510x590 mm x 1 Lane TR7007LQ Plus:@6 μm, 10 μm, 15 μm - 765 x 610 mm |
PCB Thickness |
0.6 - 5mm |
Max PCB Weight |
3kg. Optional: 5kg |
Top Clearance |
@5.5 μm, 6 μm: 25 mm; @10 μm, 12 μm, 15 μm: 50 mm |
Bottom Clearance |
40 mm |
Edge Clearance |
3 mm |
Conveyor Height |
880 – 920 mm
* SMEMA Compatible
|
Inspection Functions
Defects |
Insufficient Paste Excessive Paste Shape Deformity Missing Paste & Bridging |
Measurement |
Height Area Volume Offset |
Dimensions
WxDxH |
TR7007Q Plus: 1000 x 1400 x 1650 mm TR7007Q Plus DL: 1000 x 1500 x 1650 mm TR7007LQ Plus: 1365 x 1720 x 1710 mm
TR7007QI Plus: 1000 x 1360 x 1600 mm TR7007QI Plus DL: 1000 x 1717 x 1600 mm |
Weight |
TR7007Q Plus: 775 kg TR7007Q Plus DL: 825 kg TR7007LQ Plus: 982 kg
TR7007QI Plus: 775 kg TR7007QI Plus DL: 825 kg
|
Optical System
Imaging Method |
|
Top Camera |
|
Angle Camera |
|
Imaging Resolution |
|
Lighting |
|
3D Technology |
|
Max. 3D Range |
|
Motion Table & Control
X-Axis Control |
|
Y-Axis Control |
|
Z-Axis Control |
|
X-Y Axis Resolution |
|
Board Handling
Max PCB Size |
|
PCB Thickness |
|
Max PCB Weight |
|
Top Clearance |
|
Bottom Clearance |
|
Edge Clearance |
|
Conveyor |
|
Imaging System
Camera |
|
X-ray Source |
|
Imaging Resolution |
|
Inspection Method |
|
Motion Table & Control
X-Axis Control |
|
Y-Axis Control |
|
Z-Axis Control |
|
X-Y Axis Resolution |
|
Board Handling
Max PCB Size |
|
PCB Thickness |
|
Max PCB Weight |
|
Top Clearance |
|
Bottom Clearance |
|
Edge Clearance |
|
Conveyor Height |
|
Dimensions
WxDxH |
|
Weight |
|
Power Requirement |
|
|