[August 14, 2026 – San Jose, CA] Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will be exhibiting at SEMICON West held at Moscone Center, San Francisco, CA, USA from October 13 - 15, 2026.
Visit TRI's Booth No. 5972 to learn more about the latest Advanced WLP/PLP and SEMI Back-End Package Inspection and metrology solutions. TRI's Inspection and Metrology Applications include: Chiplet & Chip-on-Wafer (CoW), System-in-Package (SiP), Advanced WLP, TSV Metrology,μBump, Cu Pillar, Surface Topology, Profiling, Wafer Thickness, Thin Film Thickness, Patterned Wafer, Inner Crack / Chipping, After Sawing Defects, Die Underfill, Glue, Epoxy & Flux, Wafer Bumping and Die / Wire Bonding.
TRI will exhibit its back-end inspection solutions, including the 3D SEMI AOI
TR7900Q SII and
TR7700Q SII-S with AI-Powered 3D Inspection that can inspect die, wire diameters of up to 15 μm (0.6 mil), SiP, underfill, bumps, and more. The TR7900Q SII fully integrates with the loader/unloader module to ease the handling of strips and magazines.
TRI will also exhibit the back-end inspection solutions, the
TR7007Q SII-S for C4 bumps (~100 μm Ø), Mini-LED, and 008004 paste inspection applications. The lineup will also include an X-ray Inspection Demo Station. TRI's SEMI AXI solutions can inspect C4 bumps, Cu pillars, TGV, and more.
Visit TRI at Booth No. 5972 at SEMICON West 2026 to explore the future of SEMI inspection.
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