News

[June 18, 2026 – Taipei, Taiwan] Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join SEMICON Taiwan held at Taipei Nangang Exhibition Center, Hall 1, 1F from September 2 to 4, 2026. Visit TRI's Booth No. I3210 to learn more about the latest Advanced WLP/PLP and SEMI Back-End Package Inspection and metrology solutions.

TRI's SEMI solutions feature powerful AI-powered inspection algorithms, micro measurements, and multiple sensors. The systems are fully compatible with SECS/GEM SEMI communication standards. Supported applications include Chiplet and Chip-on-Wafer (CoW), System-in-Package (SiP), Advanced WLP, TSV, TGV, µBump, Cu Pillar, Surface Topology, Thin Film Thickness, Sawing Trench, and RDL.
 

SWIR+AI	TSV Metrology	Wafer AVI	TGV X-ray Inspection	Wire

During the exhibition, TRI will showcase the TR7950 capable of wafer inspection and micro measurement metrology. The platform features Auto Focus and a Microscope for sub-µm high-resolution inspection defects, alongside a SWIR (Short-wave Infrared) Camera and TSV/Thin Film Metrology Module.

For the first time, TRI will present the TR7900Q SII-P, an Advanced Packaging 3D SEMI AOI high-precision platform. This new system features a 65 MP camera with 1.2 µm high resolution and a Dual Linear Motor Gantry, achieving 0.1 µm X-Y axis resolutions.

TRI will also exhibit back-end inspection solutions, including the TR7007Q SII-S for C4 bumps (~100 µm Ø), Mini-LED, and 008004 paste inspection applications. Additionally, the lineup will feature an X-ray Inspection Demo Station highlighting TRI's SEMI AXI solutions, capable of inspecting TGV, C4 bumps, and Cu pillars.

Visit TRI's Booth No. I3210 at SEMICON Taiwan 2026 to explore TRI's cutting-edge SEMI solutions.