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Inspection Innovations at SEMICON Taiwan 2022

2022/07/20

[July 20, 2022 – Taipei, Taiwan] Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join SEMICON Taiwan held at Taipei Nangang Exhibition Center, Hall 1 – 4F from September 14 - 16, 2022. Visit booth #M1034 to experience the latest in Smart Factory Semiconductor Inspection.

TRI's AI-powered AOI solutions for the Semiconductor and Advanced Packaging Industry can inspect Die and Wire Bonding, wafer surface and bumps, epoxy, and foreign material detection.

Also exhibiting will be the 3D Semiconductor and Advanced Packaging Optical Inspection TR7900Q SII for semiconductor industry applications with built-in magazine loader/unloader, 2.5 µm high resolution, and an outstanding 25MP camera. The TR7900Q SII can inspect Die Bonding, Ball Bonding, Ribbon Bond, Wedge Bond, Wire Bonding, SiP, underfill, SMD, bumps, and solder joints.
 
                
Die Bonding     Heavy Wedge Bond     Wire Profile Tracing     Wafer Chip Metrology     Scratch on Die

TRI will showcase the 3D SPI, TR7007Q Plus, and the AI-powered 3D AOI, TR7700Q SII, with the improved 21MP 8.18 µm configuration. The lineup will also include an X-ray Inspection Demo Station and TRI's innovative AI Solutions, which include the AI Station, AI Training Tool, and the AI Verify Host.

Stop by TRI's booth to discuss Semiconductor and Advanced Packaging Industry Inspection Solutions with our staff. For more information about TRI's Inspection capabilities for the Semiconductor and Advanced Packaging Industry, please follow this Link.
 
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About TRI

Test Research, Inc. (TRI) offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. Learn more at http://www.tri.com.tw. For sales and service information, please write to us at marketing@tri.com.tw or call +886-2-2832 8918.
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