產品介紹

自動光學檢測機 (AOI)

TR7700QE-S建立在具有5.5 µm高解析度與12 MP成像技術的高精準度平台上，適用於半導體和封裝行業。一站式3D AOI能夠檢測打線接合、黏晶、SMD、凸塊與錫點等缺陷，並且智能 3D AOI解決方案可透過量測功能和靈活的檢測演算法提升準確性。

• 半導體與封裝技術檢測
• 超高精準度走停式3D AOI
• 打線接合與黏晶缺陷檢測
• 即時透過TRI智能編程進行檢測

Defects
Measurement

WxDxH
Weight

Imaging Method	Stop-and-Go Imaging
Top Camera	12 Mpix
Angle Camera	N/A
Imaging Resolution	5.5 µm
Lighting	Multi-phase true color LED
3D Technology	Quad Digital Fringe Projectors
Max. 3D Range	12 Mpix@ 5.5 µm: 4 mm

Imaging Speed

12 Mpix 3D @ 5.5 µm: 4.1 cm²/sec
12 Mpix 2D @ 5.5 µm: 10.3 cm²/sec

Note: Depending on component distribution

X-Axis Control	Linear Motor with Motion Controller (Ballscrew + AC Servo Motor Optional)
Y-Axis Control	Dual driven ballscrew + AC-servo with Motion Controller
Z-Axis Control	Ballscrew + AC Servo with Motion Controller
X-Y Axis Resolution	1 µm

Max PCB Size	330 x330 mm* *Depending on component distribution, the vailable PCB size could be different
PCB Thickness	0.6-5 mm
Max PCB Weight	3 kg
Top Clearance	25 mm
Bottom Clearance	40 mm. Optional: 100 mm
Edge Clearance	3 mm. Optional: 5 mm
Conveyor	Inline Height: 880 – 920 mm * SMEMA Compatible

Component	Missing Tombstoning Billboarding Polarity Rotation Shift Wrong Marking (OCV) Defective Upside Down Extra Component Foreign Material Lifted Component
Solder	Solder Fillet Height Solder Volume % Excess Solder Insufficient Solder Bridging Through-hole Pins Lifted Lead Golden Finger Scratch/Contamination

WxDxH	1100 x 1730 x 1750 mm Note: not including signal tower, signal tower height 520 mm
Weight	920 kg

Capabilities
Defects

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