[March 7, 2025 – Taipei, Taiwan] Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join NEPCON China 2025 held at Shanghai World Expo Exhibition & Convention Center from April 22 – 24, 2025. Visit booth #1J50 to experience the latest in Electronics Manufacturing Inspection.
TRI's 2025 lineup includes the AI-powered 3D SEMI AOI,
TR7700Q SII-S, can inspect die, wire diameters of up to 15 μm (0.6 mil), SiP, underfill, bumps, and more. The SEMI AOI is equipped with a 25MP camera, 2.5 µm high-resolution, and mechanical design, setting new standards in accuracy and efficiency.
Also presenting at NEPCON China 2025 will be the High-Resolution 3D CT AXI
TR7600F3D LL SII for multiple industry applications and the newly released High-Throughput High-Pin Count board tester,
TR8001 SII, specialized for Telecom Data Center Boards Applications.
TRI will also present the Ultra-High-Speed 3D AOI,
TR7700QH SII, inspection speed of up to 80 cm²/sec, along with the enhanced 3D SPI,
TR7007Q SII, the multi-angle 3D AOI,
TR7500QE Plus, and the Multi-core ICT,
TR5001Q SII LED INLINE.
The
AI-powered solutions from TRI include the AI training tool, the AI Station, AI Verify Host, AI Smart Programming, and more. TRI solutions comply with the latest
Smart Factory standards like the IPC-Hermes-9852, IPC-CFX, and IPC-DPMX.
Visit TRI's booth #1J50 at NEPCON China 2025 for a personal demonstration of TRI's High-End, High-Accuracy Test and Inspection Solutions.
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