News

[November 9, 2026 – Taipei, Taiwan] Test Research, Inc. (TRI) is pleased to introduce the dual-sided Top and Bottom Automated Optical Inspection (AOI) solution, TR7700Q TB SII, offering 3D top-view and 2D bottom-view inspection tailored for the electronics manufacturing industry.
 

The TR7700Q TB SII features TRI's AI-powered algorithms with smart programming tools, metrology-grade measurement capabilities, and high-speed Stop-and-Go imaging of up to 57 cm²/sec. Utilizing Quad Digital Fringe Projectors and multi-phase true color LED lighting, the optical system pairs a 12 MP 3D top camera with a 6.5 MP 2D bottom camera across two configurations: a high-resolution setting (10 µm top / 10 µm bottom) and a high-speed setting (15 µm top / 12.5 µm bottom).

Designed for high-coverage detection of THT, DIP, and SMD defects, the AOI system inspects intricate component and solder joint defects. The TR7700Q TB SII detects component anomalies such as missing, tombstoned, billboarded, shifted, upside-down, or lifted components, polarity errors, and wrong markings (OCV), alongside comprehensive THT and solder joint checks, including pin height, pin angle, pin offset, pinhole, blowhole, fillet height, solder volume percentage, bridging, wetting, lifted leads, and gold finger scratches or contamination.

The TR7700Q TB SII supports a maximum 3D height range of 40 mm, with 50 mm top clearance and 40 mm bottom clearance for PCBs up to 510 x 510 mm. The TR7700Q TB SII eases MES connectivity and supports current Smart Factory standards, including IPC-CFX, IPC-DPMX, and The Hermes Standard (IPC-HERMES-9852).

 

Please visit the following link below to learn more about the TR7700Q TB SII:
https://www.tri.com.tw/en/product/product_detail-11-2-1880.html