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Explore Inspection and Metrology Solutions at WESEMiBAY 2026

2026/08/10

[August 10, 2026 – Shenzhen, China] Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join WESEMiBay held at Shenzhen Convention & Exhibition Center from October 14 - 16, 2026.

Visit TRI's Booth No. 8D01 to learn more about the latest Advanced WLP/PLP and SEMI Back-End Package Inspection and metrology solutions. TRI's Inspection and Metrology Applications include: Chiplet & Chip-on-Wafer (CoW), System-in-Package (SiP), Advanced WLP, TSV Metrology,μBump, Cu Pillar, Critical Dimension, Surface Topography, Profiling, Wafer thickness, Thin Film Thickness, Patterned Wafer, Inner Crack / Chipping, After Sawing Defects, Die Underfill, Glue, Epoxy & Flux, Wafer Bumping and Die / Wire Bonding.

Visit TRI at Booth No. 8D01 at WESEMiBay 2026 to explore the future of SEMI inspection.
 
 
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About TRI

 
Test Research, Inc. (TRI) offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. Learn more at http://www.tri.com.tw. For sales and service information, please write to us at marketing@tri.com.tw or call +886-2-2832 8918.
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