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News

Advanced Packaging Inspection Solutions at PSECE 2025

2025/09/26

[September 26, 2025 – Pasay City, Philippines] MOSRA Automation, in cooperation with Test Research, Inc. (TRI), will participate in the 20th Philippines Semiconductor & Electronics Convention and Exhibition (PSECE). The exhibition will be held at the SMX Convention Center, Pasay City, Metro Manila, from October 28 to 30, 2025.

Visit MOSRA Automation's booth (No. 175/176) to discover the latest advancements in inspection and metrology solutions for the electronics manufacturing industry and semiconductors industry.

TRI's SEMI Inspection and Metrology Applications include:

  • Chiplet & Chip-on-Wafer (CoW)
  • System-in-Package (SiP)
  • Advanced WLP
  • TSV Metrology
  • TGV Inspection
  • µBump & Cu Pillar
  • IR Inner Defects
  • Surface Topology Profiling
  • Thin Film Thickness
  • Patterned Wafer
  • After Sawing Defects
  • Die Underfill
  • Glue, Epoxy & Flux
  • Wafer Bumping
  • Wire / Die Bonding
 
Visit MOSRA to discuss the latest in Inspection and Metrology technologies for the advanced packaging and semiconductor industry. For more information about TRI's SEMI Solutions, please visit the link below,
https://www.tri.com.tw/en/product/product-85-2.html

 
 
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About TRI

TRI (TWSE: 3030), offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. Learn more at http://www.tri.com.tw. For sales and service information, please write to us at marketing@tri.com.tw or call +886-2-2832 8918.

About MOSRA Automation Solutions, Inc.

MOSRA Automation offers solutions from conceptual, prototyping to developing standard automation products or customs automation to achieve manufacturing goals: Engineering Conceptual Design, System Alpha-Tool Prototyping, Engineering Design and Assembly and Automation Controls. Aside of Automation MOSRA are also have field expertise in Liquid Dispensing, Manufacturing Equipment Distribution, Smart Manufacturing. Learn more at https://nswautomation.com/NSW/.
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