[September 4, 2023 – Taipei, Taiwan]
Test Research, Inc. (TRI), the leading provider of test and inspection systems for the electronics manufacturing industry, is set to participate in NEPCON Asia, taking place at the Shenzhen World Exhibition & Convention Center (Baoan New Hall) from October 11 to 13, 2023. Visit booth #5D68 to experience the latest advancements in Smart Factory Test and Inspection.
At NEPCON Asia, TRI will showcase the multi-angle 3D AOI, TR7500QE Plus, equipped with four side cameras and 1 top high-resolution camera. Also exhibiting will be the industry-leading speed 3D AOI TR7700QH SII and the enhanced 3D SPI TR7007Q SII.
TRI's lineup includes the high-coverage 3D AXI TR7600F3D LL SII for sharp image quality and the high-speed 3D CT AXI TR7600 SIII for multiple industry applications. Also presenting at NEPCON Asia will be the Multi-core ICT TR5001Q SII LED INLINE and the high-throughput ICT TR8100H SII with high pin count of up to 11,088 pins.
Realize your production line's potential with TRI's PCBA Test and Inspection solutions and Industry 4.0 data-driven management system, YMS 4.0. TRI's systems are designed to interoperate with other manufacturing equipment to minimize downtime, optimize production quality, and reduce operator workload.