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News

TRI introduces new 3D SPI and 3D AOI Innovations at productronica 2021

2021/09/22

[September 22, 2021 – Munich,Germany] Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join productronica 2021 held at Messe München Center from November 16 – 19, 2021. Visit booth No. A2-139 to experience TRI's newly released test and inspection solutions.

TRI will showcase the newly released 3D SPI, TR7007DI Plus, equipped with an improved motion controller and enhanced 2D lighting for sharper inspection images. The new multi-angle 3D AOI TR7500QE SII is equipped with 4 side cameras and 1 top high-resolution camera.


Also exhibiting will be the 3D AOI TR7700Q SII with an industry-leading speed of up to 57cm2/sec. TRI's lineup will also include the high-end 3D AXI TR7600F3D SII and the Multi-core ICT with In-System LED Analysis function TR5001Q SII INLINE.


TRI's 2021 lineup features Smart Factory innovations that aim to optimize the current inspection through AI-powered algorithms, multiple 3D Technologies, metrology Inspection, real-time SPC trends, and M2M communications.​-TRONIK, TRI's distributor in Europe, will host a Webinar on 3D AXI.
 
 
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About TRI

TRI offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and 3D Automated X-ray Inspection (AXI) systems to Manufacturing Defect Analyzers (MDAs) and In-Circuit Test equipment, TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. Learn more at http://www.tri.com.tw. Learn more at http://www.tri.com.tw. For sales and service information, please write to us at trieurope@tri.com.tw or call +49 9119 4017827.