[June 21, 2021 – Taipei, Taiwan] Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join NEPCON Asia held at Shenzhen World Exhibition & Convention Center (Baoan) from October 20 – 22, 2021. Visit booth #1H55 to experience the latest in Smart Factory Test and Inspection.
Join TRI at NEPCON Asia 2021 to discover TRI's AI-powered Inspection solutions. TRI will showcase the recently released 3D SPI, TR7007Q Plus, equipped with an improved motion controller and enhanced 2D lighting for sharper inspection images.
Also exhibiting will be the 3D AOI TR7700Q SII with an industry-leading speed of up to 57cm2
/sec. TRI's lineup will also include the high-end 3D AXI TR7600F3D SII and the Multi-core ICT with In-System LED Analysis function TR5001Q SII INLINE.
Realize your production line's potential with TRI's PCBA Test and Inspection solutions and Industry 4.0 data-driven management system, YMS 4.0. TRI's systems are designed to interoperate with other manufacturing equipment to minimize downtime, optimize production quality, and reduce operator workload.
Test Research, Inc. (TRI) offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and 3D Automated X-ray Inspection (AXI) systems to Manufacturing Defect Analyzers (MDAs), In-Circuit Test equipment (ICT), and Functional Testing (FCT), TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. Learn more at www.tri.com.tw
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