[December 22, 2020 – Taipei, Taiwan] Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, is pleased to announce the release of the high-reliability TR77000QM SII 3D AOI.
The TR7700QM SII is built on a high precision platform with 5.5 µm high resolution 12 MP imaging technology for the Semiconductor & Packaging industry and other high reliability industries.
As the miniaturization of components and PCB boards increases, the demand for resolution inspection increases; TRI inspection platforms have robust metrology capabilities that enable high accuracy and reliability inspection, lowering the false call rates. TRI’s 3D AOI technologies range from Depth from Focus (DFF), 3D Blue Laser, and Moiré projection for virtually Zero-escape Inspection.
Please visit the following link below to learn more about the TR7700QM SII:
https://www.tri.com.tw/en/product/product_detail-11-2-1619-1.html
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About TRI
TRI offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From 3D Solder Paste Inspection (SPI), 2D and 3D Automated Optical Inspection (AOI), and 3D Automated X-ray Inspection (AXI) systems to Manufacturing Defect Analyzers (MDAs), Functional Testers (FCT) and In-Circuit Testers (ICT), TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing test and inspection requirements. Learn more at
http://www.tri.com.tw. For sales and service information, please write to us at
marketing@tri.com.tw or call +886-2-2832 8918.
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