[May 3, 2019 – Shanghai, China] Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, announces that the company's next generation 3D AOI, TR7700 SV 3D, received the 2019 EM Asia Innovation Award of Outstanding Product of the Year. The award ceremony was held during the 2019 NEPCON China Exhibition in Shanghai, China.
The TR7700 SV 3D AOI is enhanced with high resolution of 10 µm optical resolution and 12MP high-speed camera. TRI's next generation AOI has improved image quality at the industry-leading speed of up to 60cm2/s. The TR7700 SV 3D is also equipped with a dual-blue laser module enabling the 3D AOI of reflective and transparent parts. The TR7700 SV 3D's Multi-Scan Function enables it to easily inspect a board with different heights, optimizing your production line's cycle time.
Realize your production line's potential with TRI's PCBA Test and Inspection solutions, and Industry 4.0 data-driven management system, YMS 4.0. TRI's systems are designed to interoperate with other manufacturing equipment to minimize downtime, optimize production quality and reduce operator workload.
Test Research, Inc. (TRI) offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and 3D Automated X-ray Inspection (AXI) systems to Manufacturing Defect Analyzers (MDAs), In-Circuit Test equipment (ICT), and Functional Testing (FCT), TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. Learn more at www.tri.com.tw
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