We use cookies to improve your user experience and for web traffic statistics purposes. By continuing to use this website, you agree to our use of cookies. Our Privacy & Cookie Policy contains more information on such use and explains how to disable cookies.
The currently displayed page is not available in the selected language. Select Yes to go to =A= version, No to go to =B= version, or click the X symbol to stay on this page.
  • =A=
  • =B=
About Us Solutions News Customer Service Investor Relations

News

TRI to Co-Exhibit with Speedline Technologies at NEPCON South China 2011

2011/08/29

[August 29, 2011— Taipei, Taiwan] Test Research, Inc. (TRI), a leading test and inspection systems provider for the electronics manufacturing industry, is proud to announce its upcoming cooperation with Speedline Technologies at NEPCON South China 2011. Held from August 30 to September 01 at the Shenzhen Convention and Exhibition Center in Shenzhen, China, the exhibition presents an ideal opportunity to share the outcomes realized from the cooperation between TRI and Speedline Technologies with the show’s attendees and visitors. 
 
Throughout the show, the world’s fastest inline, shadow-free solder paste inspection (SPI) system, the TRI TR7007, will be co-exhibited with a Speedline Technologies MPM Momentum+ Stencil Printing System, which features best-in-class cycle time, accuracy and repeatability, to demonstrate closed loop process control capabilities. With a large number of PCB assembly defects originating during the printing process, closed loop process control enhances communication between the printer and the SPI system to reduce rework, optimize yields and contribute to improved product line efficiency. 
 
The TR7007 offers full 3D inspection of area, volume, height, shift, peak height, shape, deformation, registration, bridge, and foreign materials at a maximum 160cm²/sec at 14µm. With a 10µm resolution, the TR7007 meets the requirements for fine-pitch PCBAs and other speed-critical applications. The system even offers repeatable and accurate results on small CSP, 0201 and 01005 component inspections at an optimal price/performance ratio. 
 
Visitors are encouraged to visit booth C 06 in Hall 1 to view system demonstrations and speak with TRI representatives. To make an appointment to meet with TRI at NEPCON South China 2011, please contact shenzhen@cn.tri.com.tw or sales@tri.com.tw.
 
About TRI 
TRI offers the most robust product portfolio in the industry for automatic test and inspection solutions. From solder paste inspection (SPI), automated optical inspection (AOI) and 3D automated x-ray inspection (3D AXI) systems to manufacturing defect analyzers (MDA) and in-circuit test (ICT) equipment; TRI provides the most cost-effective solutions to meet a wide range of manufacturing test and inspection requirements. TRI also provides bare board automated optical inspection (PCB AOI) systems used in PCB manufacturing and IC Test equipment for the semiconductor industry. Established in 1989 in Taipei, Taiwan, TRI is an ISO 9001 certified company traded on the Taiwan Stock Exchange (TWSE). Learn more at www.tri.com.tw . For sales and service information, contact sales@tri.com.tw . For media inquiries, write us at press@tri.com.tw . 
 
About Speedline Technologies 
Speedline Technologies is the global leader in process knowledge, services and manufacture of capital equipment used in the printed circuit board assembly and semiconductor industries. Based in Franklin, Massachusetts, USA, the company markets five best-in-class brands: Accel microelectronics cleaning equipment; Camalot dispensing systems; Electrovert wave soldering, reflow soldering and cleaning equipment; MPM stencil and screen printing systems; and Protect global services, support and training solutions. For more information about Speedline Technologies visit www.speedlinetech.com.