[May 6, 2020 – Taipei, Taiwan] Test Research, Inc. (TRI), the leading Test and Inspection systems provider for the electronics manufacturing industry, is proud to present the new 3D solder paste inspection (SPI) solution TR7007D/Q Plus.
The TR7007D/Q Plus 3D SPI platform is equipped with an improved motion controller (EtherCat) and an enhanced 2D light module. The new motion controller achieves real-time measurements and processing on the fly while the new light module realizes higher uniformity inspection, less shadow, and improved imaging.
The TR7007D/Q Plus can accurately inspect low solder bridges and compensate board warpage for eliminating local PCB deformation. The TR7007D/Q Plus is equipped with up to four projectors to ensure a shadow-free inspection. The SPI solution eases data exchange between the production line and the MES of your choice to enable data traceability for the connected factory.
Please visit the following link below to learn more about the TR7007D/Q Plus Series:
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About TRI
Test Research, Inc. (TRI) offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and 3D Automated X-ray Inspection (AXI) systems to Manufacturing Defect Analyzers (MDAs), In-Circuit Test equipment (ICT), and Functional Testing (FCT), TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. Learn more at
www.tri.com.tw. For sales and service information, write to us at
marketing@tri.com.tw or call +886-2-2832 8918.
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