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TRI launches New Bottom-view 3D AOI

2022/03/07

[March 7, 2022 – Taipei, Taiwan] Test Research, Inc. (TRI) proudly announces the launch of the 3D high-speed bottom-view AOI solution, TR7700QB SII, performing at industry-leading speeds of up to 57 cm2/sec.
 
The TR7700QB SII is built on an enhanced mechanical platform to guarantee stability, accuracy, and precision during the inspection. The TR7700QB SII is the bottom-view 3D AOI solution with 15 µm high resolution 12 MP imaging capable of metrology-grade inspection. 
 
Connector Inspection PTH Inspection Solder Pin Inspection
 
Designed for high-coverage bottom-view inspection, the TR7700QB SII offers defect detection for Through-hole technology (THT) components and dual in-line packages. The smart-factory-ready solution is capable of data exchange and eases MES connectivity.
 
Please visit the following link below to learn more about the TR7700QB SII Series:
https://www.tri.com.tw/en/product/product_detail-11-2-1648.html

Realize your production line's potential with TRI's PCBA Test and Inspection solutions and Industry 4.0 data-driven management system, YMS 4.0. TRI's systems interoperate with other manufacturing equipment to minimize downtime, optimize production quality and reduce operator workload.
 
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About TRI

TRI offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From 3D Solder Paste Inspection (SPI), 2D and 3D Automated Optical Inspection (AOI), and 3D Automated X-ray Inspection (AXI) systems to Manufacturing Defect Analyzers (MDAs), Functional Testers (FCT) and In-Circuit Testers (ICT), TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing test and inspection requirements. Learn more at http://www.tri.com.tw. For sales and service information, please write to us at marketing@tri.com.tw or call +886-2-2832 8918.
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