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TRI’s Latest PCBA Inspection Showcased at SMT Hybrid Packaging 2015

2015/04/14

[April 14, 2015 – Taipei, Taiwan] Test Research, Inc. (TRI) will feature latest high performance SPI, AOI, AXI and ICT inspection solutions at SMT Hybrid Packaging 2015 exhibition. Visit us at booth 231 in hall 7 of Exhibition Centre Nuremberg from May 5 ~ 7, 2015 for a personal tour of the latest developments in PCBA inspection.

TRI’s 2015 portfolio includes TR7007 SII Plus SPI system designed for top performance and accuracy. Introduced in 2015 is a unique CT upgrade for TRI’s 3D AXI systems, bringing 3D CT inspection to our award winning x-ray inspection series. The complete demoed inspection and testing range includes high speed TR7500 SIII 3D AOI and TRI’s acclaimed compact ICT solution for affordable inline deployment with advanced testing capabilities.

Discover how TRI’s complete range of PCBA test solutions works together to bring you maximum value in production line and minimize production costs. Ranging from SPI, AOI, AXI, MDA and ICT, TRI’s systems are designed to interoperate with other manufacturing equipment to minimize down times, optimize production quality and reduce operator work load. Visit us at booth 231 in hall 7 for a personal tour of TRI’s solution lineup.

About TRI
TRI offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and 3D Automated X-ray Inspection (AXI) systems to Manufacturing Defect Analyzers (MDAs) and In-Circuit Test equipment, TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. Learn more at http://www.tri.com.tw. For sales and service information, write us at marketing@tri.com.tw or call +886-2-2832 8918.