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Halbleiter Inspektion (SEMI)
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INTRODUCTION
The TR7900Q SII-R is the 3D Automated Inspection and Rejection Station for the Semiconductor & Advanced Packaging Industry. The 3D SEMI AOI fully integrates with the loader/unloader module to ease handling strips and magazines. The 2.5 μm high-resolution platform can inspect die bonding, ball bonding, ribbon bond, wedge bond, epoxy, SiP, underfill, SMD, bumps, and solder joints. The Smart Factory AOI solution can inspect up to 15 μm (0.6 mil) wire diameters.
• Advanced Package Defect Detection for Wire Bonding and Die Bonding
• Inking module for Reject Identification
• 2.5 μm High-Resolution 3D AOI with Metrology-grade* measurements capabilities
• Built-in Loader and Unloader for Magazine handling
• Powered by AI Algorithms for Wire Detection*
• Inspection of Au, Al, Ag, and Cu Wires down to 15 μm dimensions
• Bond Inspection: ball bond, wedge bond, and ribbon bond
• Shortwave Infrared (SWIR) Lighting to detect inner cracks and chipping*
• Clean Room Class 100 - ISO Class 5 (ISO 14644-1)
*Optional Modules
Optical System
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Imaging Method |
Stop-and-Go Imaging |
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Top Camera |
25 Mpix |
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Imaging Resolution |
2.5 µm |
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Lighting |
Multi-phase True Color LED |
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3D Technology |
Quad Digital Fringe Projectors |
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Max. 3D Height Range |
600 μm |
Defect Marking Method
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Marking Method |
Ink Printer. Optional: Ink Pen |
Motion Table & Control
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X Axis Control |
Linear Motor |
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Y Axis Control |
Dual Linear Motor |
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X-Y Axis Resolution |
0.1 µm |
Board Handling
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Max. Stack Magazine Qty. |
3 Magazines (based on Magazine width 125 mm) |
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Magazine Dimension |
Width: 50 - 175 mm
Length: 120 - 320 mm
Height: 80 - 160 mm
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Strip Dimension |
Width: 35 - 180 mm
Length: 100 - 300 mm
Thickness: 0.1 - 1.5 mm
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Max. Strip Weight |
0.4 kg |
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Strip Carrier / Fixing |
Gripper Conveyor |
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Top Clearance |
15 mm |
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Bottom Clearance |
6 mm |
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Edge Clearance |
3 mm |
Inspection Functions
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Die Bonding |
Missing
Orientation
Rotation
Shift
Tilted
Chipping
Crack
Scratch
Foreign Material
Bond line thickness
Epoxy on Die
Epoxy Coverage
Epoxy Height
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Wire Bonding |
Broken
Short
Sweep/Sink
Missing
Sway
Collapse
Loop Height
Sagged Wire
Cross Wire Gap
Wire Tracing
Ball Bond Diameter
Ball Placement
Stitch Width
Stitch Coverage over Ball
Ball-off Pad
Ball touch Pad Distance
Clubbed Ball
Ball Thickness
Lifted Ball
Low Landing
Bond on Contamination
Foreign Material
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Bonding Area/Pad |
Copper Protrusion
Crack
Chipping
Exposed Copper
Exposed Nickel
Target Material
Scratches or Brush Marks
Oxidation
Foreign Material
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Dimensions
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WxDxH |
2370 x 1455 x 1700 mm
Note: not including signal tower, signal tower height 515 mm |
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Weight |
1120 kg. With Auto Load/Unload Module: 1280 kg |
Optical System
| Imaging Method |
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| Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Field of View |
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Inspection Performance
| Imaging Speed |
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| Height Resolution |
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| Max. Solder Height |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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| Z-Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Optical System
| Imaging Method |
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| Top Camera |
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| Angle Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Max. 3D Range |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor |
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Imaging System
| Camera |
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| X-ray Source |
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| Imaging Resolution |
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| Inspection Method |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Dimensions
| WxDxH |
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| Weight |
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| Power Requirement |
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