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Optische Inspektion
Elektrischer Test
- Fertigungsungsfehler-analysator (MDA/Manufacturing Defects Analyzer)
  - TR518 SII INLINE
  - TR518 SII
- In-Circuit-Tester (ICT)

Fertigungsungsfehler-analysator (MDA/Manufacturing Defects Analyzer)

TR518 SII INLINE


TR518 SII INLINE

INTRODUCTION

Der TR518 SII INLINE ist eine kostengünstige, flexible und gleichzeitig automatisierte Testplattform für MDA-Tests auf mittelgroßen Platinen mit bis zu 1024 Testpunkten. Die vollelektrische SMEMA-kompatible Plattform verfügt über einen minimalen Platzbedarf und bietet vollständige TR518 SII MDA-Fähigkeit.

• Voll ausgestattete Inline-Testplattform
• Ausgelegt für TRI MDA-Tester
• Minimaler Platzbedarf durch SMEMA-Integration
• Vollständig elektrisches Design ohne Druckluft
• Bis zu 1024 analoge MDA-Testpunkte

Tester Specifications

Analog Test Points	1024 analog test points
Operating System	Microsoft^® Windows compatible PC with USB, Windows 10
Fixture Type	Inline/Manual Insertion

Analog Testing

Analog Test Hardware

6-wire measurement switching matrix
Programmable AC/DC/DC High voltage and current sources
Component R/L/C measurement

Optional Components

Analog Hardware	TestJet vectorless open circuit detection Programmable High Voltage DC Source up to 100V / 100 mA
Yield Management System	YMS 4.0

Board Handling

Min. PCB Size	70 x 70 mm
Max. PCB Size	330 x 250 mm
PCB Thickness	0.6 ~ 5 mm

Dimensions

WxDxH	600 x 900 x 1595 mm Note: not including signal tower, height: 515 mm
Weight	340 kg

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Optical System

Imaging Method
Camera
Imaging Resolution
Lighting
3D Technology
Field of View

Inspection Performance

Imaging Speed
Height Resolution
Max. Solder Height

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution
Z-Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height

Inspection Functions

Defects
Measurement

Dimensions

WxDxH
Weight

Optical System

Imaging Method
Top Camera
Angle Camera
Imaging Resolution
Lighting
3D Technology
Max. 3D Range

Inspection Performance

Imaging Speed

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor

Inspection Functions

Component
Solder

Dimensions

WxDxH
Weight

Imaging System

Camera
X-ray Source
Imaging Resolution
Inspection Method

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height

Inspection Functions

Capabilities
Defects

Dimensions

WxDxH
Weight
Power Requirement

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