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Halbleiter Inspektion (SEMI)
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INTRODUCTION
The TR7720S is an AI-powered Small Form AOI for the Semiconductor & Packaging industry Inspection of wire bonding, die bonding, SMD, and solder joints. Enhanced with Metrology measurements and a robust mechanical structure, the TR7720S offers precise and accurate results. The 5.5 μm High-Resolution AOI solution can inspect up to 50 μm (2 mil) wire diameters.
• Advanced Package Defect Detection for Wire Bonding and Die Bonding
• 5.5 μm High-Resolution Small Form Factor AOI
• AI-Powered Inspection Algorithms for Wire Detection*
• Metrology-grade measurements* improving data traceability
• Inspection of Au, Al, Ag, and Cu Wires down to 50 μm Dimensions
• Bond Inspection: ball bond, wedge bond, and ribbon bond
• Smart Factory Ready – Real-Time SPC Trends
*Optional Modules
Optical System
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Imaging Method |
Stop-and-Go Imaging |
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Top Camera |
12 Mpix |
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Imaging Resolution |
5.5 µm |
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Lighting |
Multi-phase True Color LED, Coaxial Lighting |
Imaging Performance
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Max. Imaging Speed |
10.3 cm²/sec |
Motion Table & Control
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X-Y-Z Axis Control |
Ballscrew + AC Servo with Motion Controller |
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X-Y-Z Axis Resolution |
1 µm |
Board Handling
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Max. PCB Size |
310 x 250 mm |
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PCB Thickness |
0.1-5 mm |
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Max. PCB Weight |
1 kg |
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Top Clearance |
25 mm |
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Bottom Clearance |
40 mm |
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Edge Clearance |
3 mm |
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Conveyor |
Inline Height: 880 – 920 mm
* SMEMA Compatible |
Inspection Functions
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Die Bonding |
Missing
Orientation
Shift
Rotation
Chipping
Crack
Scratch
Foreign Material
Epoxy on Die
Epoxy Coverage
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Molding /
Underfill Materials
(EMC, CUF, NCP, NCF, MUF)
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Area coverage
Shapes/Dimensions
Surface
Void
Damage
Crack
Scratches
Delamination
Contamination
Surface particles
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Bonding Area/Pad |
Copper Protrusion
Crack
Chipping
Exposed Copper
Exposed Nickel
Target Material
Scratches or Brush Marks
Oxidation
Foreign Material
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Dimensions
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WxDxH |
750 x 1460 x 1700 mm
Note: not including signal tower, signal tower height 272.5 mm |
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Weight |
710 kg |
Optical System
| Imaging Method |
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| Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Field of View |
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Inspection Performance
| Imaging Speed |
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| Height Resolution |
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| Max. Solder Height |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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| Z-Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Optical System
| Imaging Method |
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| Top Camera |
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| Angle Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Max. 3D Range |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor |
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Imaging System
| Camera |
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| X-ray Source |
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| Imaging Resolution |
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| Inspection Method |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Dimensions
| WxDxH |
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| Weight |
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| Power Requirement |
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Mitgliederbereich
