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TR8100LV
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TR8100LV
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INTRODUCTION
Entwickelt für das Testen großer und komplexer Platinen zielt das TR8100LV TRI Top-of-the-Line-Board-Test-System auf den Niederspannungs-Testmarkt. TR8100LVs Vakuumsystem sorgt für vollen Stiftkontakt und mit bis zu 3584 poligen Digital-MUX freier Architektur erlaubt das System schnellere und einfachere Prüfung von großen Pin-Count-Geräten und schnelle Programmentwicklung. *TRI ToggleScan® ＆ "VregTest® Technologie kombiniert Boundary Scans mit Lösungen für begrenzten Testzugangsvorgänge. *"ToggleScan®" & "VregTest®" ist ein eingetragendes Warenzeichen von Test Research, Inc.
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• Digital 1:1 driver/receiver per pin architecture design
• Testlösung für hohe Fehlerabdeckung mit Vacuum-Aufnahme
• Niederspannungsgerätetests und hohe Testgeschwindigkeit
• Freundliche Benutzeroberfläche mit schneller und einfacher Programmentwicklung
Tester Specifications
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Analog/hybrid test points |
TR8100LV: 3584
TR8100LLV: 5632 |
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Operating System |
Microsoft® Windows compatible PC, Windows 10 |
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Fixture Type |
Offline press or vacuum type fixture |
Standard Testing Components
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Analog Test Hardware |
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6-wire measurement switching matrix
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Programmable AC/DC/DC High voltage and current sources
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AC/DC voltage, DC current measurement, frequency
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Component R/L/C measurement
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Synthesized Arbitrary Waveform Generator
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TestJet vectorless open circuit detection
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Digital Testing |
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Non-multiplexing 1:1 per pin architecture with independent per-pin level setting
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DUT power supplies: 5 V@5 A, 3.3 V@5 A, 12 V@5A, 0.2~20 V@3 A and -3~-20 V@3 A
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On-board Flash, EEPROM, MAC programming
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Optional Components
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Analog Hardware |
Fixture Conversion Kits for Teradyne, GenRad |
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Digital Testing |
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Programmable DUT power supplies: 75 V / 8 A, 200W maximum output power
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Includes BScan Chain Test, BScan Cluster Test, BScan Virtual Nails Test, BScan Virtual Chain Test and IEEE1149.6 Test
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Yield Management System |
YMS 4.0 |
Dimensions
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WxDxH |
TR8100LV: 1150 x 850 x 800 mm
TR8100LLV: 1550 x 850 x 800 mm |
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Weight |
TR8100LV: 390 kg
TR8100LLV: 450 kg |
Optical System
| Imaging Method |
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| Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Field of View |
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Inspection Performance
| Imaging Speed |
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| Height Resolution |
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| Max. Solder Height |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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| Z-Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Optical System
| Imaging Method |
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| Top Camera |
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| Angle Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Max. 3D Range |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor |
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Imaging System
| Camera |
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| X-ray Source |
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| Imaging Resolution |
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| Inspection Method |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Dimensions
| WxDxH |
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| Weight |
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| Power Requirement |
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