|
|
INTRODUCTION
The TR7720S is an AI-powered Small Form AOI for the Semiconductor & Packaging industry Inspection of wire bonding, die bonding, SMD, and solder joints. Enhanced with Metrology measurements and a robust mechanical structure, the TR7720S offers precise and accurate results. The 5.5 μm High-Resolution AOI solution can inspect up to 50 μm (2 mil) wire diameters.
• Advanced Package Defect Detection for Wire Bonding and Die Bonding
• 5.5 μm High-Resolution Small Form Factor AOI
• AI-Powered Inspection Algorithms for Wire Detection*
• Metrology-grade measurements* improving data traceability
• Inspection of Au, Al, Ag, and Cu Wires down to 50 μm Dimensions
• Bond Inspection: ball bond, wedge bond, and ribbon bond
• Smart Factory Ready – Real-Time SPC Trends
*Optional Modules
Optical System
|
Imaging Method |
Stop-and-Go Imaging |
|
Top Camera |
12 Mpix |
|
Imaging Resolution |
5.5 µm |
|
Lighting |
Multi-phase True Color LED, Coaxial Lighting |
Imaging Performance
|
Max. Imaging Speed |
10.3 cm²/sec |
Motion Table & Control
|
X-Y-Z Axis Control |
Ballscrew + AC Servo with Motion Controller |
|
X-Y-Z Axis Resolution |
1 µm |
Board Handling
|
Max. PCB Size |
310 x 250 mm |
|
PCB Thickness |
0.1-5 mm |
|
Max. PCB Weight |
1 kg |
|
Top Clearance |
25 mm |
|
Bottom Clearance |
40 mm |
|
Edge Clearance |
3 mm |
|
Conveyor |
Inline Height: 880 – 920 mm
* SMEMA Compatible |
Inspection Functions
|
Die Bonding |
Missing
Orientation
Shift
Rotation
Chipping
Crack
Scratch
Foreign Material
Epoxy on Die
Epoxy Coverage
|
|
Molding /
Underfill Materials
(EMC, CUF, NCP, NCF, MUF)
|
Area coverage
Shapes/Dimensions
Surface
Void
Damage
Crack
Scratches
Delamination
Contamination
Surface particles
|
|
Bonding Area/Pad |
Copper Protrusion
Crack
Chipping
Exposed Copper
Exposed Nickel
Target Material
Scratches or Brush Marks
Oxidation
Foreign Material
|
Dimensions
|
WxDxH |
750 x 1460 x 1700 mm
Note: not including signal tower, signal tower height 272.5 mm |
|
Weight |
710 kg |
Optical System
| Imaging Method |
|
| Camera |
|
| Imaging Resolution |
|
| Lighting |
|
| 3D Technology |
|
| Field of View |
|
Inspection Performance
| Imaging Speed |
|
| Height Resolution |
|
| Max. Solder Height |
|
Motion Table & Control
| X-Axis Control |
|
| Y-Axis Control |
|
| Z-Axis Control |
|
| X-Y Axis Resolution |
|
| Z-Axis Resolution |
|
Board Handling
| Max PCB Size |
|
| PCB Thickness |
|
| Max PCB Weight |
|
| Top Clearance |
|
| Bottom Clearance |
|
| Edge Clearance |
|
| Conveyor Height |
|
Optical System
| Imaging Method |
|
| Top Camera |
|
| Angle Camera |
|
| Imaging Resolution |
|
| Lighting |
|
| 3D Technology |
|
| Max. 3D Range |
|
Motion Table & Control
| X-Axis Control |
|
| Y-Axis Control |
|
| Z-Axis Control |
|
| X-Y Axis Resolution |
|
Board Handling
| Max PCB Size |
|
| PCB Thickness |
|
| Max PCB Weight |
|
| Top Clearance |
|
| Bottom Clearance |
|
| Edge Clearance |
|
| Conveyor |
|
Imaging System
| Camera |
|
| X-ray Source |
|
| Imaging Resolution |
|
| Inspection Method |
|
Motion Table & Control
| X-Axis Control |
|
| Y-Axis Control |
|
| Z-Axis Control |
|
| X-Y Axis Resolution |
|
Board Handling
| Max PCB Size |
|
| PCB Thickness |
|
| Max PCB Weight |
|
| Top Clearance |
|
| Bottom Clearance |
|
| Edge Clearance |
|
| Conveyor Height |
|
Dimensions
| WxDxH |
|
| Weight |
|
| Power Requirement |
|
|
Búsqueda
Área para miembros
