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Inspección por rayos X automatizada (AXI)
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INTRODUCTION
The TR7600FB SII is the Next Generation AXI with a new X-ray Imaging Structure Design for Clearer images. The Smart 3D AXI is powered by AI-Inspection Algorithms, AI-Void Detection, and Programming. The AXI solution can inspect large boards, up to 850 mm x 520 mm and up to 12kg in weight. The TR7600FB SII lowers the escapes and false calls without compromising the production line's cycle time.
• New X-ray Imaging Structure Design for Clearer Images
• AI Inspection Algorithms, AI-Void Detection, and Programming
• 5 µm High Precision for Comprehensive Defect Detection
• Next Generation Mechanical Design for Higher Speed up to 20 FOV/s
• Inline fine-tuning for multiple samples without interrupting production
• Large Board Inspection, up to 850 mm x 520 mm, up to 12 kg in weight
• Smart Factory Ready with Easy MES Connectivity
• Applications: Aerospace, Advanced Packaging, Automotive, Data Center, IIOT, Medical and Mobile Devices.
• Communication Standard: SMEMA, SECS/GEM, IPC-CFX-2591, IPC-HERMES-9852
Optical System
| Imaging Method |
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| Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Field of View |
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Inspection Performance
| Imaging Speed |
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| Height Resolution |
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| Max. Solder Height |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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| Z-Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor Height |
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Optical System
| Imaging Method |
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| Top Camera |
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| Angle Camera |
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| Imaging Resolution |
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| Lighting |
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| 3D Technology |
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| Max. 3D Range |
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Motion Table & Control
| X-Axis Control |
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| Y-Axis Control |
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| Z-Axis Control |
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| X-Y Axis Resolution |
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Board Handling
| Max PCB Size |
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| PCB Thickness |
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| Max PCB Weight |
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| Top Clearance |
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| Bottom Clearance |
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| Edge Clearance |
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| Conveyor |
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Imaging System
| Camera |
Flat Panel Detector |
| X-ray Source |
40 -130 kV |
| Imaging Resolution |
5 μm - 30 μm |
| Inspection Method |
2D, 2.5D, 3D Slicing, Planar CT (Optional) |
Motion Table & Control
| X-Axis Control |
High-precision ballscrew + AC-servo controller |
| Y-Axis Control |
High-precision ballscrew + AC-servo controller |
| Z-Axis Control |
High-precision ballscrew + AC-servo controller |
| X-Y Axis Resolution |
N/A |
Board Handling
| Max PCB Size |
850 x 520 mm |
| PCB Thickness |
0.4 - 7 mm |
| Max PCB Weight |
12 kg |
| Top Clearance |
@ 30 μm: 60 mm
@ 25 μm: 80 mm
@ 20 μm: 90 mm
@ 15 μm: 90 mm
@ 10 μm: 90 mm
@ 5 μm: 90 mm |
| Bottom Clearance |
@ 30 μm: 50 mm
@ 25 μm: 50 mm
@ 20 μm: 50 mm
@ 15 μm: 40 mm
@ 10 μm: 20 mm
@ 5 μm: 10 mm |
| Edge Clearance |
3 mm or 5 mm |
| Conveyor Height |
880 - 920 mm. Optional: 940 - 965 mm |
Inspection Functions
| Capabilities |
BGAs, Backdrill, Barrel fill, Capacitors, Resistor, Chips, Components Under RF shields, WLCSP, DIMM Connectors, Flip-Chips, Ground Pads, Gullwing, Heat sinks, J-Leads , LED Chips, LGAs, Paladin Connector, RNET, SiP, SMT Connectors, SOIC, SOT, Thermal Pad, QFNs, QFP and THTs |
| Defects |
Missing, Misalignment, Tombstone, Billboard, Tantalum Polarity, Rotation, Foreign Material, Insufficient/Excess Solder, Bridging, Open, Solder Ball, Non-Wetting, Void and Lifted Lead |
Dimensions
| WxDxH |
1550 x 22400 x 1800 mm
* not including signal tower, height: 519.5 mm |
| Weight |
3770 kg |
| Power Requirement |
200 – 240 VAC, Single Phase, 50 / 60 Hz, 4 kVA |
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