Soluciones

Optical Inspection
Electrical Test
- Analizador de defectos de fabricación (MDA)
  - TR518 SII INLINE
  - TR518 SII
- Probador de circuito (ICT)
SEMI Inspection
- Optical Inspection
- X-Ray Inspection
  - TR7600 SIII Plus
  - TR7600F3D SII Plus

Inspección de la soldadura en pasta (SPI) en 3D

TR7007 SIII

INTRODUCTION

La SPI 3D TR7007 SIII funciona a una velocidad líder en la industria de hasta 200 cm²/seg. La estructura mecánica mejorada garantiza estabilidad, exactitud y precisión durante la inspección. El SPI 3D es una solución inteligente para la industria 4.0 y soporta los innovadores protocolos, como IPC Connected Factory Exchange (CFX) y el estándar IPC Hermes 9852.

• Inspección a Alta Velocidad, hasta 200 cm²/seg
• Listo para inspeccionar en minutos con la Programación Inteligente de TRI
• Multiple Industry Applications: Telecom, Consumer electronics and more
• Closed Loop Ready: Feedback and Feedforward Capabilities
• Solución Fábrica Inteligente con funcionalidad Closed Loop y tendencias SPC en tiempo real

Optical System

Imaging Method	Dynamic Imaging
Camera	4 Mpix
Imaging Resolution	10 μm, 15 µm (factory setting)
Lighting	Wide Spectrum 2D Lights (RGB+W), Coaxial Lighting
3D Technology	2-way Fringe Pattern
Field of View	4 Mpix@ 10 µm: 20 x 20 mm 4 Mpix@ 15 µm: 30 x 30 mm

Inspection Performance

Imaging Speed	4 Mpix@ 10 µm: 90 cm²/sec 4 Mpix@ 15 µm: 200 cm²/sec
Height Resolution	0.4 µm
Max. Solder Height	@ 10 µm: 400 µm @ 15 µm: 385 µm

Motion Table & Control

X-Axis Control	Linear motor + Linear Scale + EtherCAT Servo
Y-Axis Control	AC motor with ball screw + EtherCAT Servo
Z-Axis Control	AC motor with ball screw + EtherCAT Servo
X-Y Axis Resolution	0.5 µm
Z-Axis Resolution	1 µm

Board Handling

Max PCB Size	TR7007 SIII: 510 x 460 mm TR7007M SIII: 660 x 610 mm TR7007 SIII DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane
PCB Thickness	0.6-5 mm
Max PCB Weight	3kg. Optional: 5 kg
Top Clearance	50 mm
Bottom Clearance	40 mm
Edge Clearance	3 mm. Optional: 4 mm / 5 mm
Conveyor Height	880 – 920 mm * SMEMA Compatible

Inspection Functions

Defects	Insufficient Paste Excessive Paste Shape Deformity Missing Paste & Bridging
Measurement	Height Area Volume Offset

Dimensions

WxDxH	TR7007 SIII: 1100 x 1480 x 1600 TR7007M SIII: 1250 x 1740 x 1710 TR7007 SIII DL: 1100 x 1705 x 1600 mm Note: not including signal tower
Weight	TR7007 SIII: 740 kg TR7007M SIII: 991 kg TR7007 SIII DL: 925 kg

Optical System

Imaging Method
Top Camera
Angle Camera
Imaging Resolution
Lighting
3D Technology
Max. 3D Range

Inspection Performance

Imaging Speed

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor

Inspection Functions

Component
Solder

Dimensions

WxDxH
Weight

Imaging System

Camera
X-ray Source
Imaging Resolution
Inspection Method

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height

Inspection Functions

Capabilities
Defects

Dimensions

WxDxH
Weight
Power Requirement

Volver a la lista