|
|
Inspección óptica automatizada (AOI)
|
TR7700 SII Plus
 |
|
|
|
TR7700 SII Plus
|
|
|
INTRODUCTION
El primer AOI híbrido del mundo: TR7700 SII Plus, capaz de realizar inspecciones Stop-and-Go y de Imagen Dinamica para para lograr un rendimiento de inspección óptimo en todo tipo de PCBA, e.g.: Simplemente seleccione el modo de inspeccion adecuado para su producto, reduciendo el tiempo del ciclo de inspección.
• AOI Hibrida: Stop-and-Go & Dynamic Imaging
• Interfaz inteligente para programación fácil
• Transportador automático inteligente
• Inspección de materiales extraños y componentes extra
• Resolución de 6 µm, 10 µm o 15 µm
Optical System
| Imaging Method |
|
| Camera |
|
| Imaging Resolution |
|
| Lighting |
|
| 3D Technology |
|
| Field of View |
|
Inspection Performance
| Imaging Speed |
|
| Height Resolution |
|
| Max. Solder Height |
|
Motion Table & Control
| X-Axis Control |
|
| Y-Axis Control |
|
| Z-Axis Control |
|
| X-Y Axis Resolution |
|
| Z-Axis Resolution |
|
Board Handling
| Max PCB Size |
|
| PCB Thickness |
|
| Max PCB Weight |
|
| Top Clearance |
|
| Bottom Clearance |
|
| Edge Clearance |
|
| Conveyor Height |
|
Optical System
| Imaging Method |
Dynamic Imaging or Stop-and-Go on select configurations |
| Top Camera |
4 or 9 or 12 Mpix high speed color camera (factory setting) |
| Angle Camera |
N/A |
| Imaging Resolution |
6 µm, 10 µm, 15 µm (factory setting) |
| Lighting |
Multi-phase RGB+W LED |
| 3D Technology |
N/A |
| Max. 3D Range |
N/A |
Inspection Performance
| Imaging Speed |
4 Mpix@ 10 µm Dynamic Imaging: 60 cm²/sec
4 Mpix@ 15 µm Dynamic Imaging: 120 cm²/sec
9 Mpix@ 10 µm Dynamic Imaging: 72 cm²/sec
12 Mpix@ 6 µm Dynamic Imaging: 40 cm²/sec
4 Mpix@ 10 µm Stop-and-Go: 4.5 FOV/sec
4 Mpix@ 15 µm Stop-and-Go: 4.5 FOV/sec
|
Motion Table & Control
| X-Axis Control |
Ballscrew + AC-servo controller |
| Y-Axis Control |
Ballscrew + AC-servo controller |
| Z-Axis Control |
N/A |
| X-Y Axis Resolution |
1 µm |
Board Handling
| Max PCB Size |
TR7700 SII Plus@ 10 µm, 15 µm: 510 x 460 mm
TR7700 SII Plus@ 6 µm: 400 x 400 mm
TR7700 SII Plus DL@ 10 µm, 15 µm: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane
TR7700 SII Plus DL@ 6 µm: 400 x 310 mm x 2 lanes, 400 x 400 mm x 1 lane
|
| PCB Thickness |
0.6-5 mm |
| Max PCB Weight |
3 kg |
| Top Clearance |
10 µm, 15 µm: 25 mm [48 mm optional◎※]
6 µm: 25 mm
◎The air blow module does not apply to this option
※This option is only available for 4 Mpix camera.
|
| Bottom Clearance |
10 µm, 15 µm: 40 mm [100 mm optional]
6 µm: 40 mm
|
| Edge Clearance |
3 mm [5 mm optional] |
| Conveyor |
Inline
Height: 880 – 920 mm
* SMEMA Compatible
|
Inspection Functions
| Component |
Missing
Tombstoning
Billboarding
Polarity
Rotation
Shift
Wrong Marking (OCV)
Defective
Upside Down
Extra Component
Foreign Material
|
| Solder |
Excess Solder
Insufficient Solder
Bridging
Through-hole Pins
Lifted Lead
Golden Finger
Scratch/Contamination
|
Dimensions
| WxDxH |
TR7700 SII Plus: 1000 x 1400 x 1650 mm
TR7700 SII Plus DL: 1000 x 1500 x 1650 mm
Note: not including signal tower, signal tower height 520 mm
|
| Weight |
TR7700 SII Plus: 600 kg
TR7700 SII Plus DL: 650 kg
|
Imaging System
| Camera |
|
| X-ray Source |
|
| Imaging Resolution |
|
| Inspection Method |
|
Motion Table & Control
| X-Axis Control |
|
| Y-Axis Control |
|
| Z-Axis Control |
|
| X-Y Axis Resolution |
|
Board Handling
| Max PCB Size |
|
| PCB Thickness |
|
| Max PCB Weight |
|
| Top Clearance |
|
| Bottom Clearance |
|
| Edge Clearance |
|
| Conveyor Height |
|
Dimensions
| WxDxH |
|
| Weight |
|
| Power Requirement |
|
|
Búsqueda
Área para miembros
