Soluciones

Optical Inspection
Electrical Test
- Analizador de defectos de fabricación (MDA)
  - TR518 SII INLINE
  - TR518 SII
- Probador de circuito (ICT)
SEMI Inspection
- Optical Inspection
- X-Ray Inspection
  - TR7600 SIII Plus
  - TR7600F3D SII Plus

Inspección óptica automatizada (AOI)

TR7700QE-S

INTRODUCTION

La plataforma TR7700QE-S es de alta precisión con tecnología de imágenes de 12 MP de alta resolución de 5,5 µm para la industria de semiconductores. La plataforma AOI 3D Stop-and-Go puede inspeccionar Wire Bonding, Die Bonding, SMD y uniones de soldadura. TR7700QE-S también incorpora capacidades de metrología y algoritmos de inspección flexibles.

• Inspección Automatizada para la Industria de Semiconductores
• AOI 3D Stop-and-Go de Alta Precisión
• Inspección de defectos en Wire Bonding y Die Bonding
• Listo para inspeccionar en minutos con la Programación Inteligente de TRI

Optical System

Imaging Method	Stop-and-Go Imaging
Top Camera	12 Mpix
Imaging Resolution	5.5 µm
Lighting	Multi-phase True Color LED

Imaging Performance

Max. Imaging Speed

12 Mpix 3D @ 5.5 µm: 4.1 cm²/sec
12 Mpix 2D @ 5.5 µm: 10.3 cm²/sec

Note: Depending on component distribution

Motion Table & Control

X Axis Control	Linear Motor with Motion Controller (Ballscrew + AC Servo Motor Optional)
Y Axis Control	Dual driven ballscrew + AC-servo with Motion Controller
Z Axis Control	Ballscrew + AC Servo with Motion Controller
X-Y Axis Resolution	1 µm

Board Handling

Max. PCB Size	330 x330 mm* *Depending on component distribution
PCB Thickness	0.6-5 mm
Max. PCB Weight	3 kg
Top Clearance	25 mm
Bottom Clearance	40 mm. Optional: 100 mm
Edge Clearance	3 mm. Optional: 4 mm / 5 mm
Conveyor	Inline Height: 880 – 920 mm * SMEMA Compatible

Inspection Functions

Component Defects	Missing Tombstoning Billboarding Polarity Rotation Shift Wrong Marking (OCV) Defective, Upside Down Extra Component Foreign Material Lifted Component
Solder Joint Defects	Solder Fillet Height Solder Volume % Excess Solder Insufficient Solder Bridging Through-hole Pins Lifted Lead Golden Finger Scratch/ Contamination

Dimensions

WxDxH	1100 x 1730 x 1750 mm Note: not including signal tower, signal tower height 520 mm
Weight	920 kg

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Optical System

Imaging Method
Camera
Imaging Resolution
Lighting
3D Technology
Field of View

Inspection Performance

Imaging Speed
Height Resolution
Max. Solder Height

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution
Z-Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height

Inspection Functions

Defects
Measurement

Dimensions

WxDxH
Weight

Optical System

Imaging Method
Top Camera
Angle Camera
Imaging Resolution
Lighting
3D Technology
Max. 3D Range

Inspection Performance

Imaging Speed

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor

Inspection Functions

Component
Solder

Dimensions

WxDxH
Weight

Imaging System

Camera
X-ray Source
Imaging Resolution
Inspection Method

Motion Table & Control

X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution

Board Handling

Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height

Inspection Functions

Capabilities
Defects

Dimensions

WxDxH
Weight
Power Requirement

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