Probador de circuito (ICT)
INTRODUCTION
La próxima generación de ICT + FCT en paralelo ofrece un rendimiento revolucionario de prueba paralela Multi-núcleo con hasta 4 núcleos independientes de alto rendimiento. El controlador manual más avanzado de TRI cuenta con un diseño de seguridad manos libres aprobado por la industria para un funcionamiento interrumpido. Interfaz del TR5001Q/D SII QDI de desconexión rápida durable y la auto-calibración incorporada y el autodiagnóstico garantizan la confiabilidad de las pruebas a largo plazo.
• Nueva Generación de Tester en Paralelo de Multi-Núcleo Flexible• Auto-calibration by DMM
Tester Specifications
Analog/hybrid test points
TR5001Q SII QDI: 4096
TR5001D SII QDI: 3328
Operating System
Microsoft® Windows compatible PC with USB, Windows 7-10
Fixture Type
Offline press type fixture with QDI
Standard Testing Components
Analog Test Hardware
6-wire measurement switching matrix
Programmable AC/DC/DC High voltage and current sources
AC/DC voltage, DC current measurement
Component R/L/C measurement
Optional Components
Analog Hardware
TestJet vectorless open circuit detection
Arbitrary Waveform Generator
Digital Testing
Non-multiplexing 1:1 per pin architecture with independent per-pin level setting
Serial Test Controller (STC) Programming
DUT power supplies: 5 V@3 A, 3.3 V@3 A, 12 V@3A, -12 V@1 A and 24 V@3 A
DPS Programmable DUT Power supply :(1) DPS3514: 30Vmax/5Amax/100Wmax per channel /4CH per DPS
Programmable DUT power supplies: 75 V / 8 A max, 200W maximum output power
Includes BScan Chain Test, BScan Cluster Test, BScan Virtual Nails Test, BScan Virtual Chain Test and IEEE1149.6 Test
Up to 8 High Speed Serial Ports, On-board Flash, EEPROM, MAC programming
Yield Management System
YMS 4.0
System Requirement
Power Requirement
200 – 240 V, Single Phase, 50/60 Hz, 3 kVA.
Power Feature
Power Line Earth Ground Auto Detection. Power 50/60 Hz Auto Detection.
Air Requirement
Dry Air 4 – 8 kg/cm2
Dimensions
WxDxH
1200 x 950 x 1850 mm
Weight
700 kg
VIDEO
Optical System
Imaging Method
Camera
Imaging Resolution
Lighting
3D Technology
Field of View
Inspection Performance
Imaging Speed
Height Resolution
Max. Solder Height
Motion Table & Control
X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution
Z-Axis Resolution
Board Handling
Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height
Optical System
Imaging Method
Top Camera
Angle Camera
Imaging Resolution
Lighting
3D Technology
Max. 3D Range
Motion Table & Control
X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution
Board Handling
Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor
Imaging System
Camera
X-ray Source
Imaging Resolution
Inspection Method
Motion Table & Control
X-Axis Control
Y-Axis Control
Z-Axis Control
X-Y Axis Resolution
Board Handling
Max PCB Size
PCB Thickness
Max PCB Weight
Top Clearance
Bottom Clearance
Edge Clearance
Conveyor Height
Dimensions
WxDxH
Weight
Power Requirement
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