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Probador de circuito (ICT)
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TR8100LV
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TR8100LV
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INTRODUCTION
Diseñado para la prueba de PCBA grandes y complejos, el TR8100LV es un sistema de prueba de tarjetas de primera calidad de TRI para el mercado de la prueba de baja tensión. El sistema de vacío del TR8100LV asegura un contacto de pin total y, con una arquitectura libre de MUX digital de 3584 pines, el sistema permite una prueba más rápida y simple de dispositivos de conteo de pines grandes, y desarrollo rápido del programa. Incluye la *tecnología ToggleScan® & VregTest® de TRI con Escaneo de límites con soluciones para tarjetas de acceso de prueba limitadas. *"ToggleScan®" & "VregTest®" es una marca registrada de Test Research, Inc.
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• 1:1 controlador/receptor digital por diseño de arquitectura de pin
• Solución de prueba de cobertura de falla alta con accesorio de vacío
• Prueba de dispositivo de baja tensión y velocidad de prueba rápida
• UI amigable con desarrollo del programa rápido y fácil
Tester Specifications
Analog/hybrid test points |
TR8100LV: 3584
TR8100LLV: 5632 |
Operating System |
Microsoft® Windows compatible PC, Windows 10 |
Fixture Type |
Offline press or vacuum type fixture |
Standard Testing Components
Analog Test Hardware |
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6-wire measurement switching matrix
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Programmable AC/DC/DC High voltage and current sources
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AC/DC voltage, DC current measurement, frequency
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Component R/L/C measurement
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Synthesized Arbitrary Waveform Generator
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TestJet vectorless open circuit detection
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Digital Testing |
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Non-multiplexing 1:1 per pin architecture with independent per-pin level setting
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DUT power supplies: 5 V@5 A, 3.3 V@5 A, 12 V@5A, 0.2~20 V@3 A and -3~-20 V@3 A
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On-board Flash, EEPROM, MAC programming
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Optional Components
Analog Hardware |
Fixture Conversion Kits for Teradyne, GenRad |
Digital Testing |
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Programmable DUT power supplies: 75 V / 8 A, 200W maximum output power
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Includes BScan Chain Test, BScan Cluster Test, BScan Virtual Nails Test, BScan Virtual Chain Test and IEEE1149.6 Test
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Yield Management System |
YMS 4.0 |
Dimensions
WxDxH |
TR8100LV: 1150 x 850 x 800 mm
TR8100LLV: 1550 x 850 x 800 mm |
Weight |
TR8100LV: 390 kg
TR8100LLV: 450 kg |
Optical System
Imaging Method |
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Camera |
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Imaging Resolution |
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Lighting |
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3D Technology |
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Field of View |
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Inspection Performance
Imaging Speed |
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Height Resolution |
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Max. Solder Height |
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Motion Table & Control
X-Axis Control |
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Y-Axis Control |
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Z-Axis Control |
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X-Y Axis Resolution |
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Z-Axis Resolution |
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Board Handling
Max PCB Size |
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PCB Thickness |
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Max PCB Weight |
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Top Clearance |
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Bottom Clearance |
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Edge Clearance |
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Conveyor Height |
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Optical System
Imaging Method |
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Top Camera |
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Angle Camera |
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Imaging Resolution |
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Lighting |
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3D Technology |
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Max. 3D Range |
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Motion Table & Control
X-Axis Control |
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Y-Axis Control |
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Z-Axis Control |
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X-Y Axis Resolution |
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Board Handling
Max PCB Size |
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PCB Thickness |
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Max PCB Weight |
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Top Clearance |
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Bottom Clearance |
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Edge Clearance |
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Conveyor |
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Imaging System
Camera |
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X-ray Source |
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Imaging Resolution |
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Inspection Method |
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Motion Table & Control
X-Axis Control |
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Y-Axis Control |
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Z-Axis Control |
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X-Y Axis Resolution |
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Board Handling
Max PCB Size |
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PCB Thickness |
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Max PCB Weight |
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Top Clearance |
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Bottom Clearance |
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Edge Clearance |
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Conveyor Height |
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Dimensions
WxDxH |
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Weight |
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Power Requirement |
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