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[August 26, 2026 – Munich, Germany]Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join electronica 2026, which will be held at Messe München Center from November 10 – 13, 2026. Visit booth A4-638 to experience TRI's newly released test and inspection solutions.

TRI will showcase the 3D AXI TR7600FB SII, which incorporates an innovative X-ray imaging structure to address diverse product layouts and is optimized for specialized substrates, BGAs, multilayered structures, and SiP.

TRI's lineup will also include the enhanced 3D SPI TR7007Q SII, the high-speed 3D AOI for high-throughput production TR7700QH SII and the multi-camera 3D AOI TR7500QE Plus.

The 2026 line up will also include the modular multi-core board tester TR5001 SII INLINE and the compact and lightweight full-featured ICT solution TR5001T SII TINY. TRI's AI Inspection solutions include AI Smart Programming, AI Repair Station, Training Tools, AI Station, and more. TRI Test and Inspection solutions comply with Industry 4.0 standards like the IPC-Hermes-9852, IPC-CFX, and IPC-DPMX.
 

Join us at booth A4-638 to discuss how TRI can boost your production's intelligence and discover why leading EMS companies choose TRI as their Test and Inspection partner.