[April 1, 2025 – Budapest, Hungary] E-chain, Test Research, Inc. (TRI) distributor, will join INNOELECTRO 2025, held at BOK Sportcsarnok from April 8 – 10, 2025, to showcase state-of-the-art Test and Inspection Solutions for the Smart Factory. Visit booth #C01 to experience the latest innovations for the electronics manufacturing industry.
Visit booth #C01 to learn more about the latest innovations in 3D SPI, 3D AOI, 3D AXI, and multicore ICT. Discover TRI’s the latest
Smart Factory Test and Inspection innovations. TRI's cutting-edge Optical Inspection and Test solutions optimize electronics manufacturing and the
Semiconductor and Advanced Packaging Industry through
AI-powered Inspection algorithms, multiple 3D technologies, metrology measurements, real-time SPC trends, and seamless M2M communications.
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Low Solder Bridge
3D SPI |
3D Inspection Height Profile
3D AOI |
BGA HiP Defect
3D AXI |
TRI's solution portfolio has a wide range of high-end features and advanced functionality to meet current and future production line requirements. TRI's Test and Inspection platforms enable big data and data traceability, essential for a Smart Factory environment. TRI's solutions comply with Industry 4.0 standards like the IPC-Hermes-9852, the IPC-DPMX, and the Connected Factory Exchange (IPC-CFX).
Visit E-chain's booth #C01 to discover why the top EMS businesses chose TRI as their Test and Inspection Partner.
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