새 소식

[August 24, 2026 – Shenzhen, China]Test Research, Inc. (TRI), the leading provider of test and inspection systems for the electronics manufacturing industry, will join NEPCON Asia at the Shenzhen World Exhibition & Convention Center from October 27 to 29, 2026. Visit booth #13E70 to experience TRI's advanced and flexible Inspection solutions designed to increase your yield rate.
 

TRI will showcase its latest 3D AXI TR7600FB SII, featuring a new X-ray imaging structure and AI-powered inspection technology for high-precision 5 µm inspection and speeds of up to 20 FOV/s. With in-line product fine-tuning, it delivers both high efficiency and production flexibility for applications including aerospace, automotive, advanced packaging, and data centers. The lineup also includes the TR7700QH SII, an ultra-high-speed, metrology-grade inspection system featuring AI-powered Algorithms with Smart Programming and measurement capabilities.

Also presenting at NEPCON Asia will be the 3D SPI TR7007Q SII delivering up to 50% faster inspection speed than previous models and the multi-angle 3D AOI TR7500QE Plus. The ICT lineup includes the advanced ICT tester TR8100 SII featuring high accuracy, high throughput, and high fault coverage for complex PCBA testing and the TR5001 SII INLINE further boosts throughput through multi-core parallel testing, providing a more efficient and intelligent in-line testing solution.

TRI's systems are designed to interoperate with other manufacturing equipment to minimize downtime, optimize production quality, and reduce operator workload. We sincerely invite you to visit TRI at Booth 13E70 during NEPCON Asia and discover how TRI is empowering electronics manufacturing with smart factories and higher production efficiency.