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[August 18, 2026 – Hanoi, Vietnam] Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will participate as a key technology partner in the IPC CFX Demo Line at the FBC ASEAN Manufacturing Expo 2026. The event will take place from September 16–18, 2026, in Hanoi, Vietnam.
 

Organized by the Global Electronics Association (GEA), the IPC CFX Demo Line will showcase a fully connected smart manufacturing line. The demonstration will highlight seamless interoperability and machine-to-machine (M2M) communication across the electronics manufacturing ecosystem utilizing the IPC CFX standard.
 

TRI will feature two of its industryleading inspection solutions, demonstrating real-time data exchange and advanced manufacturing connectivity, the TR7007 SIII 3D SPI and the TR7700Q SII 3D AOI. The TR7007 SIII is a high-speed solder inspection solution designed to optimize the printing process. The TR7700Q SII 3D AOI is an AI-powered inspection solution that deliver zero-escape inspection for complex PCBA manufacturing.

Visitors to the FBC ASEAN Manufacturing Expo are encouraged to visit the dedicated IMES zone to witness the IPC CFX Demo Line in action and learn how standardizing M2M communication can drive efficiency, reduce costs, and elevate product quality.

For more information about TRI’s Smart Factory solutions, please visit,
https://www.tri.com.tw/en/about/about-98-2-2.html