[June 22, 2026 – Taipei, Taiwan] Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, proudly announces the launch of the TR7600 SV Series. The newly released line scan 3D AXI delivers up to a 20% performance improvement compared to the award-winning TR7600 SIII series.
Equipped with a high-speed robust platform, the TR7600 SV Series ensures fast image reconstruction and precise defect detection for BGAs, THT, SiP, and more. The multi-resolution design, ranging from 7 to 25 µm, guarantees maximum defect detection capabilities. The series accommodates diverse manufacturing needs with the TR7600 SV supporting boards up to 950 x 520 mm, and the TR7600LL SV accommodating larger PCB sizes up to 1000 x 660 mm.
Powered by advanced AI algorithms, the high-speed 3D AXI can precisely detect low-contrast defects. The system features intuitive software and an extensive component library to simplify programming, reducing engineer workload and minimizing downtime. Additional AI capabilities include the AI Verify Host (Buy Off Station), AI Image Denoising, and AI Fine Tuning, which enables operators to optimize programming, reduce programming time and fine-tune with the expertise of a senior operator.
The TR7600 SV Series easily connects with MES applications and complies with the latest Industry 4.0 standards, including IPC-CFX-2591, SECS/GEM, SMEMA, and The Hermes Standard (IPC-HERMES-9852).
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