[September 17, 2025 – Pasay City, Philippines] Wire Techniks, TRI's distributor, will join the 20th Philippine Semiconductor and Electronics Convention and Exhibition (PSECE) at the SMX Convention Center Manila, from October 28 to 30, 2025. Visit Booth No.229/230 to discuss the latest in Inspection and Metrology for the advanced packaging and semiconductor industry.
Wire Techniks will exhibit TRI's AI-powered 3D AOI,
TR7700QH SII. The TR7700QH SII can inspect at speeds of up to 80 cm
2/sec while maintaining uncompromised Gauge R&R. The 3D AOI is powered by TRI's Smart Programming, AI Algorithms, and Metrology measurement capabilities.
TRI provides a wide range of inspection and metrology solutions for the semiconductor industry, covering applications such as Advanced WLP, Patterned Wafer, Wafer Bumping, TSV Metrology, and Die/Wire Bonding. TRI's solutions can inspect for defects after sawing, underfill, and epoxy, ensuring the quality of Chiplet, Chip-on-Wafer (CoW), and System-in-Package (SiP) assemblies.
For more information about TRI's SEMI Inspection and Metrology Solutions, please visit the link below,
https://www.tri.com.tw/en/product/product-85-2.html
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About TRI
TRI (TWSE: 3030), offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. Learn more at
http://www.tri.com.tw. For sales and service information, please write to us at
marketing@tri.com.tw or call +886-2-2832 8918.
About Wired Techniks
Wired Techniks is a leading supplier of high-quality spare parts and electronic tools. With decades of industry experience, the company is dedicated to providing customers with reliable and cost-effective solutions. Wired Techniks is committed to delivering exceptional value through prompt service, competitive pricing, and a wide range of products designed to maximize the return on your assets. Learn more at
https://wiredtechniks.com/.
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