[March 12, 2025 – San Jose, CA] Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, is proud to announce that it has received two prestigious CIRCUITS ASSEMBLY New Product Introduction (NPI) Awards for the ICT TR8100 SII Series and 3D AXI TR7600 SV Series.
TR7600 SV Series – High-Throughput AI-Assisted 3D AXI
The
TR7600 SV Series 3D AXI represents a breakthrough in speed, performance, and AI-driven inspection technology. Featuring an Ultra-High-Speed 30K Line Scan system and AI-assisted algorithms, the TR7600 SV Series ensures high-quality inspections across multiple applications. The integration of AI for X-ray void detection has significantly improved first-pass yield (FPY) rates from 85% to 98%, while AI classification for complex components reduces false call rates by 88%, enhancing accuracy and efficiency at no additional cost to users.
TR8100 SII Series – High-Pin-Count In-Circuit Tester + Functional Tester
As AI technology advances and demand for AI server boards grows, the
TR8100 SII Series is engineered to support the evolving needs of the telecom electronics industry. The system introduces an industry-leading 11,088 test points, significantly increasing test capacity compared to its predecessor. Offering seamless compatibility with existing TRI test modules and fixtures, the TR8100 SII Series enables manufacturers to transition effortlessly while improving fault detection and minimizing rework costs.
TRI continues to drive innovation in electronics manufacturing with AI-powered inspection, advanced 3D technologies, metrology solutions, real-time SPC analytics, and M2M communication for smarter production.
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